Condition optimization, reliability evaluation of SiO2-SiO2 HF bonding and its application for UV detection micro flow cell

Sensors and Actuators, A: Physical

Volumn 83, Issue 1, 2000, Pages 136-141

  Nakanishi, H ^a   Nishimoto, T ^a   Kanai, M ^a   Saitoh, T ^b   Nakamura, R ^b   Yoshida, T ^a   Shoji, S ^b  

^a SHIMADZU CORPORATION   (Japan)

^b WASEDA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPOSITION EFFECTS; HELIUM; HYDROFLUORIC ACID; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR DEVICE TESTING; SILICA; THERMAL CYCLING; THERMAL EFFECTS; ULTRAVIOLET DETECTORS;

THERMAL CYCLIC TESTS; THERMAL SHOCK TESTS;

MICROELECTROMECHANICAL DEVICES;

EID: 0033743079     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(00)00301-0     Document Type: Article

References (6)

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4. Nakanishi H., Abe H., Nishimoto T., Arai A. Micro-fabrication and analytical performances of quartz and glass microchips for electrophoresis. Bunseki Kagaku. 47(6):1998;361-368.
5. 2 bonding with hydrofluoric acid, in press.
6. T. Nishimoto, H. Nakanishi et al., Microfabricated chips for capillary electrophoresis on quartz glass substrates using a bonding with hydrofluoric acid, Proc. of Micro Total Analysis Systems '98, Banf, Canada, 1998.