Direct bonding of Si wafer pairs with SiO2 and Si3N4 films with a fast linear annealing

Materials Science in Semiconductor Processing

Volumn 5, Issue 6, 2002, Pages 519-524

  Lee, Sang Hyun ^a   Song, Ohsung ^a   Yoon, C S ^b   Kim, C K ^b  

^a University of Seoul   (South Korea)

^b Hanyang University   (South Korea)

Author keywords

Bonding of Si wafer pairs with SiO2 and Si3N4 films (Si SiO2 Si3N4 Si); Direct bonding; Fast linear annealing; Heterogeneous bonding

Indexed keywords

ANNEALING; CHEMICAL BONDS; SILICON COMPOUNDS;

FAST LINEAR ANNEALING (FLA);

SILICON WAFERS;

EID: 0038756027     PISSN: 13698001     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1369-8001(02)00059-8     Document Type: Article

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