Low temperature bonding for microfabrication of chemical analysis devices

Sensors and Actuators, B: Chemical

Volumn 45, Issue 3, 1997, Pages 199-207

  Wang, Hong Ying ^a,b   Foote, Robert S ^a   Jacobson, Stephen C ^a   Schneibel, Joachim H ^a   Ramsey, J Michael ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

^b SEAGATE TECHNOLOGY   (United States)

Author keywords

Chemical analysis; Low temperature bonding; Microfabrication; Sodium silicate

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; CHEMICAL ANALYSIS; CURING; DIELECTRIC PROPERTIES; FABRICATION; LOW TEMPERATURE OPERATIONS; MECHANICAL PROPERTIES; MICROELECTRONIC PROCESSING; SEALING (CLOSING); SILICATES;

LOW TEMPERATURE BONDING; MICROCHIP DEVICES; MICROFABRICATION; SODIUM SILICATE;

MICROELECTRONICS;

EID: 0031370110     PISSN: 09254005     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0925-4005(97)00294-3     Document Type: Article

References (37)

1. D.J. Harrison, A. Manz, Z. Fan, H. Lüdi, H.M. Widmer, Capillary electrophoresis and sample injection systems integrated on a planar glass chip, Anal. Chem. 64 (1992) 1926-1932.
2. A. Manz, D.J. Harrison, E. Verpoorte, J.C. Fettinger, A. Paulus, H. Lüdi, H.M. Widmer, Planar chips technology for miniaturization and integration of separation techniques into monitoring systems. Capillary electrophoresis on a chip, J. Chromatogr. 593 (1992) 253-258.
3. S.C. Jacobson, R. Hergenröder, L.B. Koutny, R.J. Warmack, J.M. Ramsey, Effects of injection schemes and column geometry on the performance of microchip electrophoresis devices, Anal. Chem. 66 (1994) 1107-1113.
4. S.C. Jacobson, R. Hergenröder, L.B. Koutny, J.M. Ramsey, Open channel electrochromatography on a microchip, Anal. Chem. 66 (1994) 2369-2373.
5. A.W. Moore Jr., S.C. Jacobson, J.M. Ramsey, Microchip separations of neutral species via micellar electrokinetic capillary chromatography, Anal. Chem. 67 (1995) 4184-4189.
6. A.T. Woolley, R.A. Mathies, Ultra-high-speed DNA fragments separations using microfabricated capillary array electrophoresis chips, Proc. Natl. Acad. Sci. USA 91 (1994) 11348.
7. C.S. Effenhauser, A. Paulus, A. Manz, H.M. Widmer, High-speed separation of antisense oligonucleotides on a micromachined capillary electrophoresis device, Anal. Chem. 66 (1994) 2949.
8. A.T. Woolley, R.A. Mathies, Ultra-high-speed DNA sequencing using capillary electrophoresis chips, Anal. Chem. 67 (1995) 3676.
9. S.C. Jacobson, J.M. Ramsey, Integrated microdevices for DNA restriction fragment analysis, Anal. Chem. 68 (1996) 720-723.
10. S.C. Jacobson, R. Hergenröder, A.W. Moore Jr., J.M. Ramsey, Precolumn reactions with electrophoretic analysis integrated on a microchip, Anal. Chem. 66 (1994) 4127.
11. W.P. Maszara, Silicon-on-insulator by wafer bonding: A review, J. Electrochem. Soc. 138 (1991) 341-347.
12. T.R. Anthony, Dielectric isolation of silicon by anodic bonding, J. Appl. Phys. 58 (1985) 1240-1247.
13. W.H. Ko, J.T. Suminto, Semiconductor integrated circuit technology and micromachining, in: W. Gopel, J. Hasse, J.N. Zennel (Eds.), Sensors, vol. 1, VCH, Weinhein, 1989, pp. 107-168.
14. W.P. Eaton, S.H. Risbud, R.L. Smith, Wafer bonding by low temperature melting glass, Proceedings of The First International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications, U. Gösele, et al (Eds.), The Electrochemical Society, 1992, pp. 146-151.
15. L.A. Field, R.S. Muller, Fusing silicon wafers with low melting temperature glass, Sensors Actuators A21-A23 (1990) 935-938.
16. H.J. Quenzer, W. Benecke, Low-temperature silicon wafer bonding, Sensors Actuators A32 (1992) 340-344.
17. A. Yamada, T. Kawasaki, M. Kawashima, SOI by wafer bonding with spin-on glass as adhesive, Electron. Lett. 23 (1987) 39-40.
18. A. Yamada, T. Kawasaki, M. Kawashima, Bonding silicon wafer to silicon nitride with spin-on glass as adhesive, Electron. Lett. 23 (1987) 314-315.
19. K.J.D. Mackenzie, I.W.M. Brown, P. Ranchod, R.H. Meinhold, Silicate bonding of inorganic materials, I: chemical reactions in sodium silicate at room temperature, J. Mater. Sci. 26 (1991) 763-769.
20. K.J.D. Mackenzie, I.W.M. Brown, P. Ranchod, R.H. Meinhold, Silicate bonding of inorganic materials, II: reactions at high temperatures, J. Mater. Sci. 26 (1991) 769-775.
21. R.K. Iler, The Chemistry of Silica, chapter 2, Wiley, New York, 1979.
22. R.K. Iler, The Chemistry of Silica, chapter 1, Wiley, New York, 1979 pp. 47.
23. R.K. Iler, The Chemistry of Silica, chapter 2, Wiley, New York, 1979, pp. 122.
24. R.K. Iler, The Chemistry of Silica, Wiley, New York, 1979, chapter 2, pp. 126, chapter 4, pp. 329.
25. R.K. Iler, The Chemistry of Silica, chapter 4, Wiley, New York, 1979, pp. 323.
26. C.J. Brinker, G.W. Scherer, Sol-Gel Science, Academic Press, Boston, 1990.
27. T.A. Michalske, E.R. Fuller Jr., Closure and repropagation of healed cracks in silicate glass, J. Am. Ceram. Soc. 68 (1985) 586-590.
28. T.A. Michalske, K.D. Keefer, Adhesion of hydrated silicate films, Mat. Res. Soc. Symp. Proc. 121 (1988) 187-197.
29. G.E. Jellison Jr., F.A. Modine, Two-channel polarization modulation ellipsometer, Appl. Opt. 29 (1990) 959-974.
30. J.H. Schneibel, M.G. Jenkins, Slow crack growth at room temperature in FeAl, Scr. Metall. Mater. 28 (1993) 389-393.
31. W.P. Maszara, G. Goetz, A. Caviglia, J.B. McKitterick, Bonding of silicon wafers for silicon-on-insulator, J. Appl. Phys. 64 (1988) 4943-4950.
32. L. Holland, The Properties of Glass Surfaces, chapter 9,Wiley, New York, 1964, pp. 456.
33. J. Nakayama, Direct measurement of fracture energies of brittle heterogeneous materials, J. Am. Ceram. Soc. 48 (1965) 583-587.
34. S.M. Wiederhorn, Fracture surface energy of glass, J. Am. Ceram. Soc. 52 (1969) 99-105.
35. G.W. Weidmann, D.G. Holloway, Slow crack propagation in glass, Phys. Chem. Glasses 15 (1974) 116-122.
36. R.W. Davidge, G. Tappin, The effective surface energy of brittle materials, J. Mater. Sci. 3 (1968) 165-173.
37. D.M. Marsh, Plastic flow and fracture of glass, Proc. Roy. Soc. (London) 282A (1964) 33-43.