High bond energy and thermomechanical stress in silicon on sapphire wafer bonding

Applied Physics Letters

Volumn 70, Issue 22, 1997, Pages 2972-2974

  Kopperschmidt, P ^a   Kastner G ^a   Hesse, D ^a   Zakharov, N D ^a   Gosele U ^a  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0007601325     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.118760     Document Type: Article

References (13)

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