Characterization of silicon/glass anodic bond initiation toughness

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2000, Pages 241-246

  Labossiere, Paul E W ^a   Dunn, Martin L ^a   Cunningham, Shawn J ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; ELECTRONICS PACKAGING; FRACTURE MECHANICS; GLASS BONDING; INTERFACES (MATERIALS); SILICON; STRESS ANALYSIS;

ANODIC BONDING; CRACK RESISTANCE;

MICROELECTROMECHANICAL DEVICES;

EID: 0033721843     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (21)