Direct Bonding of (111) and (100) Oriented Silicon Wafers

Informacije MIDEM

Volumn 30, Issue 1, 2000, Pages 20-31

  Resnik, Drago ^a   Vrtačnik, Danilo ^a   Aljančič, Uroš ^a   Amon, Slavko ^a  

^a UNIVERSITY OF LJUBLJANA   (Slovenia)

Author keywords

Bond tensile strength; Bonding; Crystal orientation dependent bonding; Direct bonding; MEMS; MicroElectroMechanical Systems; MicroMachining; MM; Semiconductors; Silicon wafers; Surface roughness; Voids

Indexed keywords

EID: 0347069027     PISSN: 03529045     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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