Effects of plasma activation on hydrophilic bonding of Si and SiO2

Journal of the Electrochemical Society

Volumn 149, Issue 6, 2002, Pages

  Suni, T ^a   Henttinen, K ^a   Suni, I ^a   Makinen J ^b  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^b Okmetic Oyj   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ACTIVATION; CLEANING; COMPOSITION EFFECTS; DETERIORATION; HYDROPHILICITY; INTERFACES (MATERIALS); LOW TEMPERATURE EFFECTS; PLASMAS; REACTIVE ION ETCHING; SILICA; SILICON WAFERS; SURFACE STRUCTURE;

HYDROPHILIC BONDING; LOW TEMPERATURE BONDING; PLASMA ACTIVATION; PLASMA TREATMENT;

BOND STRENGTH (CHEMICAL);

EID: 0036607311     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1477209     Document Type: Article

References (11)