Evaluation of interfacial toughness and bond strength of sandwiched silicon structures

Thin Solid Films

Volumn 411, Issue 2, 2002, Pages 247-255

  Latella, Bruno A ^a   Nicholls, Tim W ^a   Cassidy, David J ^a   Barbé, Christophe J ^a   Triani, Gerry ^a  

^a Materials Division   (Australia)

Author keywords

Adhesion; Bonding; Ceramics; Fracture; Silicon

Indexed keywords

BOND STRENGTH (CHEMICAL); FRACTURE TOUGHNESS; MICROELECTRONICS; OPTIMIZATION; PARAMETER ESTIMATION; SANDWICH STRUCTURES; SOL-GELS; SURFACE TENSION;

FRACTURE ENERGY; RADIAL CRACKS; WAFER-BONDED STRUCTRUES;

SILICON WAFERS;

EID: 10644247843     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(02)00331-0     Document Type: Article

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