Silicon-glass wafer bonding with silicon hydrophilic fusion bonding technology

Sensors and Actuators, A: Physical

Volumn 72, Issue 1, 1999, Pages 46-48

  Xiao, Zhi Xiong ^a   Wu, Guo Ying ^a   Li, Zhi Hong ^a   Zhang, Guo Bing ^a   Hao, Yi Long ^a   Wang, Yang Yuan ^a  

^a PEKING UNIVERSITY   (China)

Author keywords

Glass; Hydrophilic fusion bonding technology; Silicon

Indexed keywords

ANNEALING; BOND STRENGTH (MATERIALS); SILICON; TENSILE TESTING;

HYDROPHILIC FUSION BONDING; SILICON-GLASS WAFER BONDING;

GLASS BONDING;

EID: 0033534285     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)00197-6     Document Type: Article

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