A new approach for handling and transferring of thin semiconductor materials

Microsystem Technologies

Volumn 9, Issue 3, 2003, Pages 204-209

  Bagdahn, J ^a   Knoll, H ^a   Wiemer, M ^b   Petzold, M ^a  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^b FRAUNHOFER INSTITUTE FOR MACHINE TOOLS AND FORMING TECHNOLOGY IWU   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BOND STRENGTH (MATERIALS); CRACK PROPAGATION; FRACTURE MECHANICS; INTERFACES (MATERIALS); MATERIALS HANDLING; MICROELECTROMECHANICAL DEVICES; STIFFNESS; TEMPERATURE; WSI CIRCUITS;

PROCESS TEMPERATURES; WAFER BONDED INTERFACES;

THIN FILMS;

EID: 0037283778     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-002-0226-2     Document Type: Article

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