Glass direct bonding technology for hermetic seal package

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1997, Pages 186-190

  Ando, Daizo ^a   Oishi, Kunihiko ^a   Nakamura, Tadashi ^a   Umeda, Sinji ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC SURFACE WAVE DEVICES; ELECTRODES; FREQUENCY RESPONSE; GLASS BONDING; HIGH TEMPERATURE TESTING; RELIABILITY; SURFACE MOUNT TECHNOLOGY; WSI CIRCUITS;

GLASS WAFERS; HERMETIC SEAL PACKAGE;

ACOUSTIC RESONATORS;

EID: 0030677617     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)