Improved low-temperature Si-Si hydrophilic wafer bonding

Journal of the Electrochemical Society

Volumn 150, Issue 3, 2003, Pages

  Esser, R H ^a   Hobart, K D ^a   Kub, F J ^a  

^a NAVAL RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BOND STRENGTH (MATERIALS); BONDING; HYDROPHILICITY; INFRARED IMAGING; INTERFACES (MATERIALS); LOW TEMPERATURE EFFECTS; MICROSCOPIC EXAMINATION; SILICON ON INSULATOR TECHNOLOGY;

BLADE INSERTION METHOD; BOND INTERFACE; EXFOLIATION; HYDROPHILIC WAFER BONDING;

SILICON WAFERS;

EID: 0037354302     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1545469     Document Type: Article

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