A study of Si wafer bonding via methanol capillarity

Materials Chemistry and Physics

Volumn 77, Issue 3, 2003, Pages 751-754

  Jerez Hanckes, C F ^a   Qiao, D ^a   Lau, S S ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Capillary bonding; Hydrophilic bonding; Hydrophobic bonding; Wafer bonding

Indexed keywords

BOND STRENGTH (CHEMICAL); BONDING; CAPILLARITY; HEAT TREATMENT; HYDROPHILICITY; INTERFACES (MATERIALS); METHANOL; OXIDATION; SURFACE TENSION; VACUUM APPLICATIONS;

COVALENT BONDS; LIQUID SURFACE TENSION;

SILICON WAFERS;

EID: 0037472256     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(02)00140-2     Document Type: Article

References (5)