Equivalent strengths for reliability assessment of MEMS structures

Sensors and Actuators, A: Physical

Volumn 112, Issue 1, 2004, Pages 163-174

  Chen, Kuo Shen ^a   Ou, Kuang Shun ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Failure probability; Fracture strength; MEMS; Weibull statistics

Indexed keywords

DATA REDUCTION; FABRICATION; FRACTURE TOUGHNESS; POLYSILICON; PROBABILITY; SCATTERING; STRUCTURAL DESIGN; WEIBULL DISTRIBUTION;

APPLIED LOADING MANNERS; FAILURE PROBABILITY; WEAKEST LINK THEORY; WEIBULL STATISTICS;

MICROELECTROMECHANICAL DEVICES;

EID: 2142724765     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2003.12.011     Document Type: Article

References (32)

1. Spearing S.M. Material issues in microelectromechanical systems (MEMS). Acta Mater. 48:2000;179-196.
2. Sharpe W.N. Jr., Jackson K.M., Hemker K.J., Xie Z. Effect of specimen size on Young's modulus and fracture strength of poly-silicon. J. Microelectromech. Syst. 10:2001;317-326.
3. S. Brown, et al. (Eds.), Microelectromechanical Structures for Materials Research, in: Proceedings of the Material Research Society Symposium, vol. 518, 1998.
4. Wilson C.J., Beck P.A. Fracture testing of bulk silicon microcantilever beams subjected to a side load. J. Microelectromech. Syst. 5:1996;142-150.
5. Chen K.-S., Ayon A., Spearing S. Trailing and testing the fracture strength of silicon at the mesoscale. J. Am. Ceram. Soc. 83:2000;1476.
6. Hu S.M. Critical stress in silicon brittle fracture, and effect of ion implantation and other surface treatment. J. Appl. Phys. 53:1982;3576-3580.
7. van Arsdell W., Brown S. Subcritical crack growth in silicon MEMS. IEEE J. Micromech. Syst. 8:1999;319-327.
8. Ericsson F., Schweitz J. Micromechanical fracture strength of silicon. J. Appl. Phys. 68:1990;5840-5844.
9. Koskinen J., Steinwall E., Soave R., Johnson H. Microtensile testing of free-standing poly-silicon fibers of various grain sizes. J. Micromech. Microeng. 3:1993;13-17.
10. W.N. Sharpe Jr., Measurement of Young's modulus, Poisson's ratio, and tensile strength of poly-silicon, in: Proceedings of the Tenth IEEE International Workshop on Microelectromechanical Systems (MEMS'97), Nagoya, Japan, 1997, pp. 424-429.
11. Thuchyia T., Tabata O., Sakata J., Tage Y. Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films. IEEE J. Microelectromech. Syst. 7:1998;106-113.
12. Greek S., Ericson F. Young's modulus, yield strength, and fracture strength of microelements determined by tensile testing. Mater. Res. Soc. Symp. Proc. 518:1998;51-56.
13. Saif T., MacDonald N.C. Failure of micron scale single crystal silicon bars due to torsion developed by MEMS microinstruments. Mater. Res. Soc. Symp. Proc. 518:1998;45-50.
14. Jones P.T., Johnson G.C., Howe R.T. Fracture strength of polycrystalline silicon. Mater. Res. Soc. Symp. Proc. 518:1998;197-202.
15. S.B. Brown, W. van Arsdell, C.L. Muhlstein, Materials reliability in MEMS devices, in: Proceedings of the Transducers'97, Chicago, IL, 1998, pp. 591-593.
16. Schweitz J., Ericson F. Evaluation of mechanical material properties by means of surface micromachined structures. Sens. Actuators A. 74:1999;126-133.
17. Chen G.-S., Ju M.-S., Fang Y.-K. Effects of monolithic silicon postulated as an isotropic material on design of microstructures. Sens. Actuators (A). 86:2000;108-114.
18. Gupta R.K. Electronically probed measurement of MEMS geometries. IEEE J. Microelectromech. Syst. 9:2000;380-389.
19. Petersen K.E. Silicon as a mechanical materials. Proc. IEEE. 70:1982;420-457.
20. Chen K.-S. On the unification of material strength testing for MEMS applications. Mater. Res. Soc. Symp. Proc. 687:2002;101-106.
21. Ding J.J.N., Meng Y.G., Wen S.Z. Size effect on the mechanical properties of microfabricated poly-silicon thin films. J. Mater. Res. 16:2001;2223-2228.
22. Lamon J. Statistical approaches to failure for ceramic reliability assessment. J. Am. Ceram. Soc. 71:1988;106-112.
23. Bartdorf S.B., Heinisch H.L. Jr. Weakest link theory reformulated for arbitrary fracture criterion. J. Am. Ceram. Soc. 61:1978;355-358.
24. Griffith A.A. The phenomena of rupture and flow in solids. Phil. Trans. Roy. Soc. A. 221:1920;163-198.
25. W. Weibull, A statistical theory of the strength of materials, Ing. Vetenskaps Akad. Handl., No. 151, 1939, 45 pp.
26. Weibull W. A statistical distribution function of wide applicability. J. Appl. Mech. 18:1951;293-297.
27. N.N. Nemeth, J.M. Manderschied, J.P. Gyekenyesi, Ceramic analysis and reliability evaluation of structures (CARES), NASA TP-2916, 1990.
28. A.M. Freudenthal, Statistical approach to brittle fracture, in: H. Liebowitz (Ed.), Fracture, An Advanced Treatise, Mathematical Foundations, vol. 2, Academic Press, New York, 1968.
29. Chen K.-S., Spearing S., Nemeth N. Structural design of a silicon micro-turbo generator. AIAA J. 39:2001;720-728.
30. R.W. Hertzberg, Deformation and Fracture Mechanics of Engineering Materials, 4th ed., Wiley, New York, 1996, pp. 266-273.
31. Greek S., Seassal C., Viktrrovitch P., Hjort K. The strength of surface micromachined indium phosphide devices evaluated by Weibull analysis of tensile and bending tests. Sens. Mater. 11:1999;247-256.
32. F. McClintock, A. Argon, Mechanical Behavior of Materials, Addison-Wesley, Reading, MA, 1966, pp. 504-508.