Wafer-scale room-temperature bonding between silicon and ceramic wafers by means of argon-beam surface activation

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2001, Pages 60-63

  Takagi, H ^a   Maeda, R ^a   Suga, T ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ARGON; CERAMIC MATERIALS; CRYSTAL LATTICES; ETCHING; SILICON WAFERS; SURFACE PHENOMENA; THERMAL EXPANSION; VACUUM TECHNOLOGY; WSI CIRCUITS;

CERAMIC WAFERS; SURFACE ACTIVATION;

BONDING;

EID: 0035006989     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)