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Volumn 69, Issue , 1999, Pages 491-496
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Structural and electrical quality of silicon bicrystals fabricated by a modified direct bonding technique
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ANNEALING;
BONDING;
INTERFACES (MATERIALS);
VACUUM APPLICATIONS;
MODIFIED DIRECT BONDING TECHNIQUES;
SEMICONDUCTING SILICON;
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EID: 0032644533
PISSN: 10120394
EISSN: None
Source Type: Conference Proceeding
DOI: 10.4028/www.scientific.net/ssp.69-70.491 Document Type: Article |
Times cited : (1)
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References (12)
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