Assessment of the adhesion quality of fusion-welded silicon wafers with nonlinear ultrasound

Ultrasonics

Volumn 38, Issue 1, 2000, Pages 316-321

  Wegner, A ^a   Koka, A ^a   Janser, K ^a   Netzelmann, U ^a   Hirsekorn, S ^a   Arnold, W ^a  

^a SAARLAND UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BONDING; DELAMINATION; NONDESTRUCTIVE EXAMINATION; SEMICONDUCTOR MATERIALS; SILICON WAFERS; STRAIN; ULTRASONIC TRANSMISSION; ULTRASONIC WAVES;

NONLINEAR ULTRASOUND;

ULTRASONIC TESTING;

EID: 0033880610     PISSN: 0041624X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0041-624X(99)00096-7     Document Type: Article

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