A review: On the development of low melting temperature Pb-free solders

Microelectronics Reliability

Volumn 54, Issue 6-7, 2014, Pages 1253-1273

  Kotadia, Hiren R ^a   Howes, Philip D ^b   Mannan, Samjid H ^a  

^a KING'S COLLEGE LONDON   (United Kingdom)

^b IMPERIAL COLLEGE LONDON   (United Kingdom)

Author keywords

Interfacial reactions; Intermetallic compounds; Lead free solder; Nanocomposite solders; Soldering

Indexed keywords

ALLOYING ELEMENTS; INTERFACES (MATERIALS); INTERMETALLICS; LEAD; SOLDERING; SURFACE CHEMISTRY; TIN;

CURRENT GENERATION; FUNDAMENTAL RESEARCH; FUTURE PROSPECTS; INTERFACE STABILITIES; LOW MELTING TEMPERATURES; NANOCOMPOSITE SOLDER; SN-BASED SOLDERS; SUBSTRATE RESISTANCE;

LEAD-FREE SOLDERS;

EID: 84901604241     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2014.02.025     Document Type: Review

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