Some aspects of nucleation and growth in Pb free Sn-Ag-Cu solder

Materials Science and Technology

Volumn 21, Issue 1, 2005, Pages 53-60

  Snugovsky, L ^a   Snugovsky, P ^b   Perovic, D D ^a   Sack, T ^b   Rutter, J W ^a  

^a UNIVERSITY OF TORONTO   (Canada)

^b Celestica Inc   (Canada)

Author keywords

Crystal growth; Microstucture; Nucleation; Sn Ag Cu alloy

Indexed keywords

CRYSTAL GROWTH; ENERGY DISPERSIVE SPECTROSCOPY; MICROSTRUCTURE; NUCLEATION; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; SOLDERING;

BALL GRID ARRAY (BGA); ROUGH POLISHING; SN-AG-CU ALLOY; TERNARY MICROSTRUCTURE;

TIN ALLOYS;

EID: 17044411232     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/174328405X13994     Document Type: Conference Paper

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