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Journal of Materials Science: Materials in Electronics

Volumn 11, Issue 8, 2000, Pages 587-593

Metallurgical reaction and mechanical strength of electroless Ni-P solder joints for advanced packaging applications

(3) Hung, K C a Chan, Y C a Tang, C W a

a CITY UNIVERSITY OF HONG KONG (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTALLIZATION; DIFFUSION IN SOLIDS; ELECTROLESS PLATING; ELECTRONICS PACKAGING; FRACTURE; INTERMETALLICS; NICKEL COMPOUNDS; STRENGTH OF MATERIALS;

METALLURGICAL REACTIONS;

SOLDERED JOINTS;

EID: 0034314304 PISSN: 09574522 EISSN: None Source Type: Journal
DOI: 10.1023/A:1008920527395 Document Type: Article

Times cited : (25)

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