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Journal of Electronic Materials

Volumn 39, Issue 11, 2010, Pages 2403-2411

Study of interfacial reactions between Sn(Cu) solders and Ni-Co alloy Layers

(8) Huang, K C a Shieu, F S a Huang, T S b Lu, C T b Chen, C W b Tseng, H W b Cheng, S L b Liu, C Y b

a NATIONAL CHUNG HSING UNIVERSITY (Taiwan)

b NATIONAL CENTRAL UNIVERSITY (Taiwan)

Author keywords

Interfacial reactions; Sn(Cu) solder

Indexed keywords

COMPOUND GROWTHS; COMPOUND LAYER; CU ADDITIVE; CU CONTENT; ELECTROPLATED NI; INTERFACIAL COMPOUND FORMATION; INTERFACIAL COMPOUNDS; INTERFACIAL REACTIONS; NEEDLE-LIKE; NI CONTENT; NI-CO ALLOY; PHASE FORMS; PURE SN; SN(CU) SOLDER; Y-CO ALLOY;

CERIUM ALLOYS; COBALT COMPOUNDS; COPPER ALLOYS; PHASE INTERFACES; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 78149285141 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1346-6 Document Type: Article

Times cited : (18)

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