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Volumn 55, Issue 8, 2007, Pages 2805-2814
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Investigation of diffusion and electromigration parameters for Cu-Sn intermetallic compounds in Pb-free solders using simulated annealing
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Author keywords
Diffusion; Electromigration; Intermetallic compound; Inversion; Simulated annealing
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Indexed keywords
COPPER COMPOUNDS;
ELECTROMIGRATION;
METALLIZING;
SIMULATED ANNEALING;
THERMAL AGING;
MULTI-PHASE INTERMETALLIC COMPOUNDS (IMC;
PB-FREE SOLDER JOINTS;
UNDER BUMP METALLIZATION (UBM);
INTERMETALLICS;
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EID: 34047157123
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/j.actamat.2006.12.019 Document Type: Article |
Times cited : (196)
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References (35)
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