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Volumn 55, Issue 8, 2007, Pages 2805-2814

Investigation of diffusion and electromigration parameters for Cu-Sn intermetallic compounds in Pb-free solders using simulated annealing

Author keywords

Diffusion; Electromigration; Intermetallic compound; Inversion; Simulated annealing

Indexed keywords

COPPER COMPOUNDS; ELECTROMIGRATION; METALLIZING; SIMULATED ANNEALING; THERMAL AGING;

EID: 34047157123     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2006.12.019     Document Type: Article
Times cited : (196)

References (35)
  • 6
    • 34047141846 scopus 로고    scopus 로고
    • Siewert TA, Madeni JC, Liu S. In: Proceedings of APEX conference on electronics manufacturing; 2003.
  • 11
    • 0007015920 scopus 로고
    • United States Atomic Energy Commission, Washington, DC Translated from a publication of Springer, Berlin. p. 65, 68
    • Seith W., and Heumann T. Diffusion of metals: exchange reactions (1962), United States Atomic Energy Commission, Washington, DC Translated from a publication of Springer, Berlin. p. 65, 68
    • (1962) Diffusion of metals: exchange reactions
    • Seith, W.1    Heumann, T.2
  • 12
    • 0012030092 scopus 로고    scopus 로고
    • Davis J.R. (Ed), ASM International, Materials Park (OH)
    • In: Davis J.R. (Ed). ASM specialty handbook: copper and copper alloys (2001), ASM International, Materials Park (OH) 235
    • (2001) ASM specialty handbook: copper and copper alloys , pp. 235


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.