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Journal of Electronic Materials

Volumn 39, Issue 12, 2010, Pages 2720-2731

Reactions of Sn-3.5Ag-based solders containing Zn and Al additions on Cu and Ni(P) substrates

(6) Kotadia, H R a Mokhtari, O a Bottrill, M a Clode, M P a Green, M A a Mannan, S H a

a KING'S COLLEGE LONDON (United Kingdom)

Author keywords

interfacial reactions; intermetallic; Pb free solder; Sn Ag solder alloy; spalling

Indexed keywords

ALUMINUM; INTERMETALLICS; LEAD; LEAD-FREE SOLDERS; NICKEL; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SPALLING; SUBSTRATES; SURFACE CHEMISTRY; TIN ALLOYS; ZINC;

CONTACT METALLIZATION; CONTINUOUS BARRIER; HIGH TEMPERATURE STORAGE; INTERMETALLIC COMPOUND GROWTHS; REFLOW--SOLDERING; SN-3.5AG LEAD-FREE SOLDERS; SN-AG SOLDER; SOLDER JOINT MICROSTRUCTURE;

TIN;

EID: 78049528433 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1382-2 Document Type: Conference Paper

Times cited : (50)

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