Investigation of Sn-Zn-Bi solders - Part I: Surface tension, interfacial tension and density measurements of SnZn7Bi solders

Soldering and Surface Mount Technology

Volumn 22, Issue 3, 2010, Pages 10-16

  Bukat, K ^a   Moser, Z ^b   Sitek, J ^a   Gasior, W ^b   Koscielski M ^a   Pstrus J ^b  

^a TELE AND RADIO RESEARCH INSTITUTE   (Poland)

^b INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

Author keywords

Alloys; Analysis of variance; Solders; Surface chemistry

Indexed keywords

DENSITY MEASUREMENTS; DENSITY VALUE; DESIGN/METHODOLOGY/APPROACH; DILATOMETRIC TECHNIQUES; EXPERIMENTAL TECHNIQUES; INTERFACIAL TENSIONS; LEAD-FREE FINISHES; LEAD-FREE SOLDERING; MODELING RESULTS; NUMERICAL VALUES; SN-ZN-BI; SOLDERS; THERMODYNAMIC MODELING;

ANALYSIS OF VARIANCE (ANOVA); BINARY ALLOYS; CAPILLARITY; CERIUM ALLOYS; CONTACT ANGLE; LEAD; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; REGRESSION ANALYSIS; SOLDERING; SOLDERING ALLOYS; SURFACE PROPERTIES; SURFACE TENSION; TIN; TIN ALLOYS; WETTING; ZINC;

SURFACE CHEMISTRY;

EID: 77954810965     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911011054145     Document Type: Article

References (20)

1. Bukat, K., Moser, Z., Ga̧sior, W., Sitek, J., Kościelski, M and Pstruś, J. (2008a), "Trends in wettability studies of Pb-free solders. Basic and application. Part II. Relation between surface tension, interfacial tension and wettability of leadfree Sn-Zn and Sn-Zn-Bi-Sb alloys", Archives Metallurgy and Materials, Vol.53 No.4, pp. 1064-1074.
2. Bukat, K., Sitek, J., Moser, Z., Ga̧sior, W., Kościelski, M. and Pstruś, J. (2008b), "Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance - ANOVA", Soldering & Surface Mount Technology, Vol.20 No.4, pp. 9-19.
3. Butler, J.A.V. (1932), "The Thermodynamics of the surface of solutions", Proceedings of the Royal Society London A. CXXXV, pp. 348-375.
4. COST Action 531 (2008), Atlas of Phase Diagrams for Leadfree Soldering, COST Office, Brussels, p. 136.
5. Gancarz, T., Moser, Z., Ga̧sior, W., Pstruś, J. and Henein, H. (2009), "A comparison of surface tension, viscosity and density of Sn and Sn-Ag alloys using two measurement techniques", Seventeenth Symposium on Thermophysical Properties, Boulder, CO, June 21-26, p. 59, Book of Abstracts.
6. Ganesan, S. and Pecht, M. (2006), Lead-free Electronics, Wiley, New York, NY.
7. Ga̧sior, W., Moser, Z., Dȩbski, A. and Pstruś, J. (2009), "New data to the SURDAT-database of modeled and experimental physical properties of lead-free solder alloys", Seventeenth Symposium on Thermophysical Properties, Boulder, CO, June 21-26, p. 313, Book of Abstracts.
8. Ga̧sior, W., Moser, Z., De?bski, A. and Pstruś, J. (2009), "New data to the SURDAT-database of modeled and experimental physical properties of lead-free solder alloys", Seventeenth Symposium on Thermophysical Properties, Boulder, CO, June 21-26, p. 313, Book of Abstracts. Hoar, T.P. and Melford, D.A. (1957), "The surface tension of binary liquid mixtures: lead+tin and lead+indium alloys", Trans. Faraday Society, Vol.53, pp. 315-26.
9. Kim,Y.S., Kim, K.S., Hwang,C.W. and Suganuma, K. (2003), "Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys", Journal of Alloys and Compounds, Vol.352, pp. 237-245.
10. Miyazaki, M., Mizutani, M., Takemoto, T. and Matsunawa, A. (1997), "Measurement of surface tension with wetting balance", Quarterly Journal of the Japan Welding Society, Vol.15, pp. 681-687.
11. Moser, Z., Ga̧sior, W., Dȩbski, A. and Pstruś, J. (2007), SURDAT Database of Lead-free Soldering Materials, Institute of Metallurgy and Materials Science, PAS, Cracow, OREKOP, Monograph, available at: www.imim.pl.
12. Moser, Z., Ga?sior,W., Bukat, K., Pstruś, J. and Sitek, J. (2008), "Trends in wettability studies of Pb-free solders. Basic and application. Part I. Surface tension and density measurements of Sn-Zn and Sn-Zn-Bi-Sb alloys. Experiment vs. modeling", Archives Metallurgy and Materials, Vol.53 No.4, pp. 1055-1063.
13. Moser, Z., Bukat, K., Ga?sior, W., Sitek, J., Kościelski, M. and Pstruś, J. (2009), "Effect of Bi and Sb additions on wettability of Sn-Zn alloys", Calphad XXXVIII, Prague, May 17-22, p. 59, Book of Abstracts.
14. Nakamura, Y., Sakakibara, Y., Watanabe, Y. and Amamoto, Y. (1998), "Microstructure of solder joints with electronic components in lead-free solders", Soldering & Surface Mount Technology, Vol. 10, No. 1, pp. 10-12.
15. Nakamura, Y., Sakakibara, Y., Watanabe, Y. and Amamoto, Y. (1998), "Microstructure of solder joints with electronic components in lead-free solders", Soldering & Surface Mount Technology, Vol.10, No.1, pp. 10-12. Prasad, L.C. and Jha, R.K. (2005), "Surface tension and viscosity of Sn-based binary liquid alloys", Phys. Stat. Sol. (A), Vol.202, pp. 2709-19.
16. Tanaka, T., Hack, K., Iida, T. and Hara, S. (1996), "Application of thermodynamic databases to the evaluation of surface tensions of molten alloys, salt mixtures and oxide systems", Z. Metallkunde, Vol.87, pp. 380-389.
17. Vizdal, J., Braga, M.H., Kroupa, A., Richter, K.W., Soares, D., Malheiros, L.F. and Ferreira, J. (2007), "Thermodynamic assessment of the Bi-Sn-Zn system", Calphad, Vol.31, pp. 438-448.
18. Wei, X., Huang, H., Zhou, L., Zhang, M. and Liu, X. (2007), "On the advantages of using a hypoeutectic Sn-Zn as lead-free solder material", Materials Letter, Vol.61 No.3, pp. 655-658.
19. Zhou, J., Sun,Y. and Xue, F. (2005), "Properties of lowmelting point Sn-Zn-Bi", Journal of Alloys and Compounds, Vol.397, pp. 260-264.
20. Friedel, K., Kisiel, R. and Loziński, W. (1997), "A study of wetting performance of lead-free solders", Proceedings of the 20th International Spring Seminar on Electronic Technology (ISSE'97), Szklarska Porȩba, Poland, June 8-11, pp. 13-18.