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Volumn , Issue , 2008, Pages 929-933

Nanoparticle synthesis and formation of composite solder for harsh environments

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILE ELECTRONIC EQUIPMENT; MATERIALS PROPERTIES; NANOPARTICLES; RELIABILITY; SOLDERING ALLOYS; WELDING;

EID: 58149084002     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684476     Document Type: Conference Paper
Times cited : (10)

References (11)
  • 1
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    • Lin, D. C., Liu, S, Guo, T. M., Wang, G., -X., Srivatsan, T. S., Petraroli, M., "An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin-lead solder," Materials Science and Engineering, Vol. A360 (2003), pp. 285-292.
    • (2003) Materials Science and Engineering , vol.A360 , pp. 285-292
    • Lin, D.C.1    Liu, S.2    Guo, T.M.3    Wang, G.-X.4    Srivatsan, T.S.5    Petraroli, M.6
  • 3
    • 0032206792 scopus 로고    scopus 로고
    • New Creep-Resistant, Low Melting Point Solders with Ultrafine Oxide Dispersions
    • Mavoori, H., Jin, S., "New Creep-Resistant, Low Melting Point Solders with Ultrafine Oxide Dispersions," J. Electr. Mat., Vol. 27, No. 11 (1998), pp. 1216-1222.
    • (1998) J. Electr. Mat , vol.27 , Issue.11 , pp. 1216-1222
    • Mavoori, H.1    Jin, S.2
  • 4
    • 0035455520 scopus 로고    scopus 로고
    • Creep Properties of Eutectic Sn-3.5Ag Solder Joints Reinforced with Mechanically Incorporated Ni Particles
    • Guo, F., Lee, J., Lucas, J. P., Subramanian, K. N., Bieler, T. R., "Creep Properties of Eutectic Sn-3.5Ag Solder Joints Reinforced with Mechanically Incorporated Ni Particles," J. Electr. Mat., Vol. 30, No.9 (2001), pp.1222-1227.
    • (2001) J. Electr. Mat , vol.30 , Issue.9 , pp. 1222-1227
    • Guo, F.1    Lee, J.2    Lucas, J.P.3    Subramanian, K.N.4    Bieler, T.R.5
  • 5
    • 4944261402 scopus 로고    scopus 로고
    • Development of Creep-Resistant, Nanosized Ag Particle-Reinforced Sn-Pb Composite Solders
    • Liu, J. P., Guo, F., Van, Y. F., Wang, W. B., Shi, Y. W., "Development of Creep-Resistant, Nanosized Ag Particle-Reinforced Sn-Pb Composite Solders", J. Mat. Sci., Vol. 33, No.9 (2004), pp. 958-963.
    • (2004) J. Mat. Sci , vol.33 , Issue.9 , pp. 958-963
    • Liu, J.P.1    Guo, F.2    Van, Y.F.3    Wang, W.B.4    Shi, Y.W.5
  • 6
    • 28044453784 scopus 로고    scopus 로고
    • Development of Nano-Composite Lead-Free Electronic Solders
    • Lee, A., Subramanian, K. N., "Development of Nano-Composite Lead-Free Electronic Solders," J Electr. Mat., Vol. 34, No. 11 (2005), pp. 1399-1407.
    • (2005) J Electr. Mat , vol.34 , Issue.11 , pp. 1399-1407
    • Lee, A.1    Subramanian, K.N.2
  • 7
    • 33845708252 scopus 로고    scopus 로고
    • Composite lead-free electronic solders
    • Guo, F., "Composite lead-free electronic solders," J. Mat. Sci. Mat. In Electr., Vol. 18 (2007), pp.129-145.
    • (2007) J. Mat. Sci. Mat. In Electr , vol.18 , pp. 129-145
    • Guo, F.1
  • 8
    • 20444406055 scopus 로고
    • Controlled growth of monodisperse silica spheres in the micron size range
    • Stober, W., Fink, A. J., "Controlled growth of monodisperse silica spheres in the micron size range," Colloid Interface Sci., Vol. 26 (1968), pp. 62-69.
    • (1968) Colloid Interface Sci , vol.26 , pp. 62-69
    • Stober, W.1    Fink, A.J.2
  • 9
    • 0037062828 scopus 로고    scopus 로고
    • Preparation and characterization of gold nanoshells coated with self-assembled monolayers
    • Pham, T., Jackson, J. B., Halas, N. J., Lee, T. R., "Preparation and characterization of gold nanoshells coated with self-assembled monolayers," Langmuir, Vol. 18 (2002), 4915.
    • (2002) Langmuir , vol.18 , pp. 4915
    • Pham, T.1    Jackson, J.B.2    Halas, N.J.3    Lee, T.R.4
  • 10
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    • A new hydrosol of. gold clusters. 1. Formation and particle size variation
    • Duff, D. G., Baiker, A., Edwards, P. P., "A new hydrosol of. gold clusters. 1. Formation and particle size variation," Langmuir, Vol. 9 (1993), pp. 2301-2309.
    • (1993) Langmuir , vol.9 , pp. 2301-2309
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.