Critical factors affecting the undercooling of Pb-free, flip-chip solder bumps and in-situ observation of solidification process

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1597-1603

  Kang, Sung K ^a   Cho, Moon Gi ^a   Lauro, Paul ^a   Shih, Da Yuan ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; FLIP CHIP DEVICES; MELTING; SOLIDIFICATION; THERMAL EFFECTS;

FLIP-CHIP-SIZE; UNDER BUMP METALLURGY (UBM);

SOLDERING ALLOYS;

EID: 35348906047     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374008     Document Type: Conference Paper

References (13)

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