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International Materials Reviews

Volumn 54, Issue 6, 2009, Pages 368-384

Thermomechanical behaviour of environmentally benign Pb-free solders

(1) Chawla, N a

a ARIZONA STATE UNIVERSITY (United States)

Author keywords

Creep; Mechanical shock; Microstructure; Pb free solder; Review; Thermomechanical fatigue

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; HEALTH HAZARDS; LEAD ALLOYS; LEAD-FREE SOLDERS; SILVER ALLOYS; TERNARY ALLOYS; THERMAL FATIGUE; TIN ALLOYS; VIBRATIONS (MECHANICAL);

AUTOMOTIVE COMPONENT; CELLULAR PHONE; ELECTRONIC PACKAGING; ELECTRONICS DEVICES; ENVIRONMENTALLY BENIGN; INPUT-OUTPUT; MECHANICAL SHOCK; PB FREE SOLDERS; THERMO MECHANICAL FATIGUES (TMF); THERMO-MECHANICAL BEHAVIORS;

CREEP;

EID: 71049120499 PISSN: 09506608 EISSN: 17432804 Source Type: Journal
DOI: 10.1179/174328009X461069 Document Type: Review

Times cited : (86)

References (138)

1
- 0033098524
- D. R. Frear: JOM 1994, 51, 22-27.
- (1994) JOM , vol.51 , pp. 22-27
- Frear, D.R.¹

2
- 0003957675
- San Diego, CA, Elsevier
- P. T. Vianco: in 'Encyclopedia of materials: science and engineering'; 2001, San Diego, CA, Elsevier.
- (2001) Encyclopedia of Materials: Science and Engineering
- Vianco, P.T.¹

3
- 0027003662
- R. R. Tummula: Proc. IEEE, 1992, 80, 1924-1941.
- (1992) Proc. IEEE , vol.80 , pp. 1924-1941
- Tummula, R.R.¹

4
- 71049149739
- D. R. Frear: JOM, 1988, 11, 38.
- (1988) JOM , vol.11 , pp. 38
- Frear, D.R.¹

5
- 0003860827
- New York, van Norstrand Reinhold
- R. R. Tummala and E. J. RymaszewskiMicroelectronics packaging handbook'; 1989, New York, van Norstrand Reinhold.
- (1989) Microelectronics Packaging Handbook
- Tummala, R.R.¹ Rymaszewski, E.J.²

6
- 0031185951
- P. L. Hacke, A. F. Sprecher and H. Conrad: J. Electron. Mater., 1997, 26, 774-782.
- (1997) J. Electron. Mater. , vol.26 , pp. 774-782
- Hacke, P.L.¹ Sprecher, A.F.² Conrad, H.³

7
- 0022699979
- S. Vaynman, M. E. Fine and D. A. Jeannotte: Metall. Trans., 1988, 19, 1051-1059.
- (1988) Metall. Trans. , vol.19 , pp. 1051-1059
- Vaynman, S.¹ Fine, M.E.² Jeannotte, D.A.³

8
- 0029193520
- J. Glazer: Int. Mater. Rev., 1995, 40, 65-93.
- (1995) Int. Mater. Rev. , vol.40 , pp. 65-93
- Glazer, J.¹

9
- 51249164034
- J. Glazer: J. Electron. Mater., 1994, 23, 693-700.
- (1994) J. Electron. Mater. , vol.23 , pp. 693-700
- Glazer, J.¹

10
- 0002643382
- A. Z. Miric and A. Grusd: Solder. Surf. Mount Technol., 1998, 10, 19-25.
- (1998) Solder. Surf. Mount Technol. , vol.10 , pp. 19-25
- Miric, A.Z.¹ Grusd, A.²

11
- 0010834633
- M. McCormack and S. Jin: JOM, 1993, 45, 36-40.
- (1993) JOM , vol.45 , pp. 36-40
- McCormack, M.¹ Jin, S.²

12
- 28444454389
- P. T. Vianco and D. R. Frear: JOM, 1993, 7, 14-19.
- (1993) JOM , vol.7 , pp. 14-19
- Vianco, P.T.¹ Frear, D.R.²

13
- 0030145765
- Solders in electronics
- W. J. PlumbridgeSolders in electronics', J. Mater. Sci., 1996, 3, 2501-2513.
- (1996) J. Mater. Sci. , vol.3 , pp. 2501-2513
- Plumbridge, W.J.¹

14
- 0030146520
- C. S. Oh, J. H. Shim, B. J. Lee and D. N. Lee: J Alloys Compd, 1996, 238, 155.
- (1996) J Alloys Compd , vol.238 , pp. 155
- Oh, C.S.¹ Shim, J.H.² Lee, B.J.³ Lee, D.N.⁴

15
- 0030108931
- J. H. Shim, C. S. Oh, B. J. Lee and D. N. Lee: Z. Metallkd., 1996, 87, 205.
- (1996) Z. Metallkd. , vol.87 , pp. 205
- Shim, J.H.¹ Oh, C.S.² Lee, B.J.³ Lee, D.N.⁴

16
- 0034297162
- K. W. Moon, W. J. Boettinger, U. R. Kattner, F. S. Biancaniello and C. A. Handwerker: J. Electron. Mater., 2000, 29, 1122.
- (2000) J. Electron. Mater. , vol.29 , pp. 1122
- Moon, K.W.¹ Boettinger, W.J.² Kattner, U.R.³ Biancaniello, F.S.⁴ Handwerker, C.A.⁵

17
- 0029389631
- W. Yang, L. E. Felton and R. W. Messler: J. Electron. Mater. 1995, 24, 1465.
- (1995) J. Electron. Mater. , vol.24 , pp. 1465
- Yang, W.¹ Felton, L.E.² Messler, R.W.³

18
- 0033221845
- J. Sigelko, S. Choi, K. N. Subramanian, J. P. Lucas and T. R. Bieler: J. Electron. Mater. 1999, 28, 1184.
- (1999) J. Electron. Mater. , vol.28 , pp. 1184
- Sigelko, J.¹ Choi, S.² Subramanian, K.N.³ Lucas, J.P.⁴ Bieler, T.R.⁵

19
- 0036680482
- K. S. Kim, S. H. Huh and K. Suganuma: Mater. Sci. Eng. A, 2002, A333, 106.
- (2002) Mater. Sci. Eng. A , vol.A333 , pp. 106
- Kim, K.S.¹ Huh, S.H.² Suganuma, K.³

20
- 0942266959
- F. Ochoa, J. J. Williams and N. Chawla: J. Electtron. Mater., 2003, 32, 1414-1420.
- (2003) J. Electtron. Mater. , vol.32 , pp. 1414-1420
- Ochoa, F.¹ Williams, J.J.² Chawla, N.³

21
- 11344272790
- F. Ochoa, X. Deng and N. Chawla: J. Electron. Mater., 2004, 33, 1596-1607.
- (2004) J. Electron. Mater. , vol.33 , pp. 1596-1607
- Ochoa, F.¹ Deng, X.² Chawla, N.³

22
- 36148998707
- R. S. Sidhu, S. V. Madge, X. Deng and N. Chawla: J. Electron. Mater., 2007, 26, 1615.
- (2007) J. Electron. Mater. , vol.26 , pp. 1615
- Sidhu, R.S.¹ Madge, S.V.² Deng, X.³ Chawla, N.⁴

23
- 0942266970
- X. Deng, G. Piotrowski, J. J. Williams and N. Chawla: J. Electron. Mater., 2003, 32, 1403-1413.
- (2003) J. Electron. Mater. , vol.32 , pp. 1403-1413
- Deng, X.¹ Piotrowski, G.² Williams, J.J.³ Chawla, N.⁴

24
- 51249162222
- Z. Mei, A. J. Sunwoo and J. W. Morris, Jr: Metall. Trans. A, 1992, 23A, 857.
- (1992) Metall. Trans. A , vol.23 A , pp. 857
- Mei, Z.¹ Sunwoo, A.J.² Jr Morris, J.W.³

25
- 0035426737
- K. H. Prakash and T. Sritharan: Acta Mater., 2001, 49, 2481.
- (2001) Acta Mater. , vol.49 , pp. 2481
- Prakash, K.H.¹ Sritharan, T.²

26
- 51649132316
- D. R. Frear and P. T. Vianco: Metall. Trans. A, 1994, 25A, 1509-1523.
- (1994) Metall. Trans. A , vol.25 A , pp. 1509-1523
- Frear, D.R.¹ Vianco, P.T.²

27
- 0028417171
- R. E. Pratt, E. I. Stromswold and D. J. Quesnel: J. Electron. Mater., 1994, 23, (4), 375-382.
- (1994) J. Electron. Mater. , vol.23 , Issue.4 , pp. 375-382
- Pratt, R.E.¹ Stromswold, E.I.² Quesnel, D.J.³

28
- 61349127145
- S. Hayes, N. Chawla and D. R. Frear: Microelectron. Reliab., 2009, 49, 269-1267
- (2009) Microelectron. Reliab. , vol.49 , pp. 269-1267
- Hayes, S.¹ Chawla, N.² Frear, D.R.³

29
- 0002378591
- Y. C. Chan, A. C. K. So and J. K. L. Lai: Mater. Sci. Eng. B, 1998, B55, 5-13.
- (1998) Mater. Sci. Eng. B , vol.B55 , pp. 5-13
- Chan, Y.C.¹ So, A.C.K.² Lai, J.K.L.³

30
- 0035877138
- H. L. J. Pang, K. H. Tan, X. W. Shi and Z. P. Wang: Mater. Sci. Eng. A, 2001, A307, 42-50.
- (2001) Mater. Sci. Eng. A , vol.A307 , pp. 42-50
- Pang, H.L.J.¹ Tan, K.H.² Shi, X.W.³ Wang, Z.P.⁴

31
- 0035840417
- H.-W. Miao and J.-G. Duh: Mater. Chem. Phys., 2001, 71, 255-271.
- (2001) Mater. Chem. Phys. , vol.71 , pp. 255-271
- Miao, H.-W.¹ Duh, J.-G.²

32
- 0034293761
- W. K. Choi and H. M. Lee: J. Electron. Mater., 2000, 29, 1207-1213.
- (2000) J. Electron. Mater. , vol.29 , pp. 1207-1213
- Choi, W.K.¹ Lee, H.M.²

33
- 0034295603
- F. Guo, S. Choi, J. P. Lucas and K. N. Subramanian: J. Electron. Mater., 2000, 29, 1241-1248.
- (2000) J. Electron. Mater. , vol.29 , pp. 1241-1248
- Guo, F.¹ Choi, S.² Lucas, J.P.³ Subramanian, K.N.⁴

34
- 33845420601
- D. Ma, W. D. Wang and S. K. Lahiri: J. Appl. Phys., 2002, 91, 3312-3317.
- (2002) J. Appl. Phys. , vol.91 , pp. 3312-3317
- Ma, D.¹ Wang, W.D.² Lahiri, S.K.³

35
- 0031251860
- C. R. Kao: Mater. Sci. Eng. A, 1997, A238, 196-201.
- (1997) Mater. Sci. Eng. A , vol.A238 , pp. 196-201
- Kao, C.R.¹

36
- 0003816374
- (ed. J. H. Lau) New York, Van Nostrand Reinhold
- J. W. Morris, D. Tribula, T. S. E. Summer and D. Grivas: in 'Solder joint reliability', (ed. J. H. Lau), 225-265; 1991, New York, Van Nostrand Reinhold.
- (1991) Solder Joint Reliability , pp. 225-265
- Morris, J.W.¹ Tribula, D.² Summer, T.S.E.³ Grivas, D.⁴

37
- 0000688716
- M. McCormack, S. Jin and G. W. Kammlott: Appl. Phys. Lett., 1994, 64, 580-582.
- (1994) Appl. Phys. Lett. , vol.64 , pp. 580-582
- McCormack, M.¹ Jin, S.² Kammlott, G.W.³

38
- 51249162745
- S. Jin and M. McCormack: J. Electron. Mater., 1994, 23, 735-739.
- (1994) J. Electron. Mater. , vol.23 , pp. 735-739
- Jin, S.¹ McCormack, M.²

39
- 0032206792
- H. Mavoori and S. Jin: J. Electron. Mater., 1998, 27, 1216-1222.
- (1998) J. Electron. Mater. , vol.27 , pp. 1216-1222
- Mavoori, H.¹ Jin, S.²

40
- 0033333757
- P. T. Vianco and J. A. Rejent: J. Electron. Mater., 1999, 28, 1138-1143.
- (1999) J. Electron. Mater. , vol.28 , pp. 1138-1143
- Vianco, P.T.¹ Rejent, J.A.²

41
- 0000446774
- A. K. Mukherjee, J. E. Bird and J. E. Dorn: Trans. ASM, 1969, 62, 155-169.
- (1969) Trans. ASM , vol.62 , pp. 155-169
- Mukherjee, A.K.¹ Bird, J.E.² Dorn, J.E.³

42
- 0036575144
- C. M. L. Wu and M. L. Huang: J. Electron. Mater. 2002, 31, 442-448.
- (2002) J. Electron. Mater. , vol.31 , pp. 442-448
- Wu, C.M.L.¹ Huang, M.L.²

43
- 13944280614
- M. D. Mathew, H. Yang, S. Movva and K. L. Murty: Metall. Mater. Trans. A, 2005, 36A, 99-105.
- (2005) Metall. Mater. Trans. A , vol.36 A , pp. 99-105
- Mathew, M.D.¹ Yang, H.² Movva, S.³ Murty, K.L.⁴

44
- 0031192444
- H. Mavoori, J. Chin, S. Vaynman, B. Morgan, L. Keer and M. Fine: J. Electron. Mater., 1997, 26, 783-790.
- (1997) J. Electron. Mater. , vol.26 , pp. 783-790
- Mavoori, H.¹ Chin, J.² Vaynman, S.³ Morgan, B.⁴ Keer, L.⁵ Fine, M.⁶

45
- 0037237107
- K. Wu, N. Wade, J. Cui and K. Miyahara: J. Electron. Mater., 2003, 32, 5-8.
- (2003) J. Electron. Mater. , vol.32 , pp. 5-8
- Wu, K.¹ Wade, N.² Cui, J.³ Miyahara, K.⁴

46
- 0036575677
- R. J. McCabe and M. E. Fine: Metall. Mater. Trans. A, 2002, 33A, 1531-1539.
- (2002) Metall. Mater. Trans. A , vol.33 A , pp. 1531-1539
- McCabe, R.J.¹ Fine, M.E.²

47
- 10044275284
- P. T. Vianco, J. A. Rejent and A. C. Kilgo: J. Electron. Mater., 2004, 33, 1389-1400.
- (2004) J. Electron. Mater. , vol.33 , pp. 1389-1400
- Vianco, P.T.¹ Rejent, J.A.² Kilgo, A.C.³

48
- 11344273356
- P. T. Vianco, J. A. Rejent and A. C Kilgo: J. Electron. Mater., 2004, 33, 1473-1484.
- (2004) J. Electron. Mater. , vol.33 , pp. 1473-1484
- Vianco, P.T.¹ Rejent, J.A.² Kilgo, A.C.³

49
- 14644398543
- Q. Xiao and W. D. Armstrong: J. Electron. Mater., 2005, 34, 196-211.
- (2005) J. Electron. Mater. , vol.34 , pp. 196-211
- Xiao, Q.¹ Armstrong, W.D.²

50
- 0035455208
- N. Wade, K. Wu, J. Kunii, S. Yamada and K. Miyahara: J. Electron. Mater. 2001, 30, 1228-1231.
- (2001) J. Electron. Mater. , vol.30 , pp. 1228-1231
- Wade, N.¹ Wu, K.² Kunii, J.³ Yamada, S.⁴ Miyahara, K.⁵

51
- 0037484363
- D. K. Joo, J. Yu and S. W. Shin: J. Electron. Mater., 2003, 32, 541-547.
- (2003) J. Electron. Mater. , vol.32 , pp. 541-547
- Joo, D.K.¹ Yu, J.² Shin, S.W.³

52
- 3142778461
- M. M. El-Bahay, M. E. El Mossalamy, M. Mahdy and A. A. Bahgat: J. Mater. Sci., 15, 519-526.
- J. Mater. Sci. , vol.15 , pp. 519-526
- El-Bahay, M.M.¹ El Mossalamy, M.E.² Mahdy, M.³ Bahgat, A.A.⁴

53
- 28444469256
- Y. Kariya, T. Asai and T. Suga: Proc. SPIE, 5852, 297-301.
- Proc. SPIE , vol.5852 , pp. 297-301
- Kariya, Y.¹ Asai, T.² Suga, T.³

54
- 0028737297
- La Jolla, CA, USA, Septmber IEEE
- C. H. Raeder, G. D. Schmeelk, D. Mitlin, T. Barbieri, W. Yang, L. F. Felton, R. W. Messler, D. B. Knorr and D. Lee: Proc. IEEE/ CPMT Int. Symp. on 'Electronics manufacturing technology', La Jolla, CA, USA, Septmber 1994, IEEE, 1-6.
- (1994) Proc. IEEE/ CPMT Int. Symp. on 'Electronics Manufacturing Technology , pp. 1-6
- Raeder, C.H.¹ Schmeelk, G.D.² Mitlin, D.³ Barbieri, T.⁴ Yang, W.⁵ Felton, L.F.⁶ Messler, R.W.⁷ Knorr, D.B.⁸ Lee, D.⁹

55
- 38649088577
- R. S. Sidhu and N. Chawla: Metall. Mater. Trans. A, 2008, 39A, 340-348.
- (2008) Metall. Mater. Trans. A , vol.39 A , pp. 340-348
- Sidhu, R.S.¹ Chawla, N.²

56
- 38649117869
- R. S. Sidhu, X. Deng and N. Chawla: Metall. Mater. Trans. A, 2008, 39A, 349-362.
- (2008) Metall. Mater. Trans. A , vol.39 A , pp. 349-362
- Sidhu, R.S.¹ Deng, X.² Chawla, N.³

57
- 4043115547
- M. Kerr and N. Chawla: Acta Mater., 2004, 52, 4527-4535.
- (2004) Acta Mater. , vol.52 , pp. 4527-4535
- Kerr, M.¹ Chawla, N.²

58
- 0348107253
- H. Rhee, F. Guo, J. G. Lee, K. C. Chen and K. N. Subramanian: J. Electron. Mater., 2003, 32, 1257-1264.
- (2003) J. Electron. Mater. , vol.32 , pp. 1257-1264
- Rhee, H.¹ Guo, F.² Lee, J.G.³ Chen, K.C.⁴ Subramanian, K.N.⁵

59
- 0035454943
- S. G. Jadhav, T. R. Bieler, K. N. Subramanian and J. P. Lucas: J. Electron. Mater., 2001, 30, 1197-1205.
- (2001) J. Electron. Mater. , vol.30 , pp. 1197-1205
- Jadhav, S.G.¹ Bieler, T.R.² Subramanian, K.N.³ Lucas, J.P.⁴

60
- 0038893345
- J. H. Lau, S. H. Pan and C. Chang: J. Electron. Packag., 2002, 124, 69-76.
- (2002) J. Electron. Packag. , vol.124 , pp. 69-76
- Lau, J.H.¹ Pan, S.H.² Chang, C.³

61
- 0036611639
- H. G. Song, J. W. Morris, Jr and F. Hua: JOM, 2002, 56, 30-32.
- (2002) JOM , vol.56 , pp. 30-32
- Song, H.G.¹ Jr Morris, J.W.² Hua, F.³

62
- 14644388773
- S. W. Shin and J. Yu: J. Electron. Mater., 2005, 34, 188-195.
- (2005) J. Electron. Mater. , vol.34 , pp. 188-195
- Shin, S.W.¹ Yu, J.²

63
- 0026963395
- R. Darveaux and K. Banerji: IEEE Trans. Compon. Hybr., 1992, 15, 1013-1024.
- (1992) IEEE Trans. Compon. Hybr. , vol.15 , pp. 1013-1024
- Darveaux, R.¹ Banerji, K.²

64
- 6344278527
- S. Wiese and K. J. Wolter: Microeletron. Reliab., 2004, 44, 1923-1931.
- (2004) Microeletron. Reliab. , vol.44 , pp. 1923-1931
- Wiese, S.¹ Wolter, K.J.²

65
- 0017504451
- O. D. Sherby, R. H. Klundt and A. K. Miller: Metall. Trans. A, 1977, 8A, 843-850.
- (1977) Metall. Trans. A , vol.8 A , pp. 843-850
- Sherby, O.D.¹ Klundt, R.H.² Miller, A.K.³

66
- 0019574524
- J. Lin and O. D. Sherby: Res. Mechanica, 1981, 2, 251-293.
- (1981) Res. Mechanica , vol.2 , pp. 251-293
- Lin, J.¹ Sherby, O.D.²

67
- 0037081577
- O. D. Sherby and E. M. Taleff: Mater. Sci. Eng. A, 2002, A322, 89-99.
- (2002) Mater. Sci. Eng. A , vol.A322 , pp. 89-99
- Sherby, O.D.¹ Taleff, E.M.²

68
- 0014467682
- S. L. Robinson and O. D. Sherby: Acta Metall., 1969, 17, 109-125.
- (1969) Acta Metall. , vol.17 , pp. 109-125
- Robinson, S.L.¹ Sherby, O.D.²

69
- 0004807905
- I. S. Servi and N. J. Grant: Trans. AIME, 1951, 191, 917.
- (1951) Trans. AIME , vol.191 , pp. 917
- Servi, I.S.¹ Grant, N.J.²

70
- 38649105254
- J. L. Lytton, C. R. Barrett and O. D. Sherby: Trans. TMS-AIME, 1965, 233, 1399.
- (1965) Trans. TMS-AIME , vol.233 , pp. 1399
- Lytton, J.L.¹ Barrett, C.R.² Sherby, O.D.³

71
- 71049191556
- 613
- W. A. Wood and G. R. Wilms: J. Inst. Met., 1948-1949, 75, 613.
- J. Inst. Met. , vol.75 , pp. 1948-1949
- Wood, W.A.¹ Wilms, G.R.²

72
- 0015617542
- F. A. Mohamed, K. L. Murty and J. W. Morris, Jr: Metall. Trans. 1973, 4, 935-940.
- (1973) Metall. Trans. , vol.4 , pp. 935-940
- Mohamed, F.A.¹ Murty, K.L.² Jr Morris, J.W.³

73
- 0020542757
- S. Suh, J. B. Cohen and J. Weertmen: Metall. Trans. A, 1983, 14A, 117-126.
- (1983) Metall. Trans. A , vol.14 A , pp. 117-126
- Suh, S.¹ Cohen, J.B.² Weertmen, J.³

74
- 0001670969
- J. E. Breen and J. Weertman: Trans. AIME, 1955, 203, 1230-1234.
- (1955) Trans. AIME , vol.203 , pp. 1230-1234
- Breen, J.E.¹ Weertman, J.²

75
- 0023997880
- E. Arzt and J. Rosler: Acta. Metall. Mater., 1988, 36, 1053-1060.
- (1988) Acta. Metall. Mater. , vol.36 , pp. 1053-1060
- Arzt, E.¹ Rosler, J.²

76
- 0023424771
- J. Cadek: Mater. Sci. Eng., 1987, 94, 79-92.
- (1987) Mater. Sci. Eng. , vol.94 , pp. 79-92
- Cadek, J.¹

77
- 0031257872
- J. Cadek and K. Milicka: Scr. Mater., 1997, 37, 1039-1044.
- (1997) Scr. Mater. , vol.37 , pp. 1039-1044
- Cadek, J.¹ Milicka, K.²

78
- 0000991049
- S. Spigarelli, E. Cerri, P. Bianchi and E. Evangelista: Mater. Sci. Technol., 1999, 15, 1433-1440.
- (1999) Mater. Sci. Technol. , vol.15 , pp. 1433-1440
- Spigarelli, S.¹ Cerri, E.² Bianchi, P.³ Evangelista, E.⁴

79
- 0037197312
- S. Wiese, F. Feustel and E. Meusel: Sensors Actuat. A, 2002, 99A, 188-193.
- (2002) Sensors Actuat. A , vol.99 A , pp. 188-193
- Wiese, S.¹ Feustel, F.² Meusel, E.³

80
- 71049126234
- (ed. M. Cohen) New York, AIME
- E. Orowan: in 'Dislocations in metals', (ed. M. Cohen), 131; 1954, New York, AIME.
- (1954) Dislocations in Metals , vol.131
- Orowan, E.¹

81
- 84996187471
- U. F. Kocks: Phil. Mag., 1966, 13, 541-566.
- (1966) Phil. Mag. , vol.13 , pp. 541-566
- Kocks, U.F.¹

82
- 0017480976
- R. S. W. Shewfelt and L. M. Brown: Phil. Mag., 1977, 35, 945-962.
- (1977) Phil. Mag. , vol.35 , pp. 945-962
- Shewfelt, R.S.W.¹ Brown, L.M.²

83
- 0020202650
- E. Arzt and M. F. Ashby: Scr. Metall., 1982, 16, 1285-1290.
- (1982) Scr. Metall. , vol.16 , pp. 1285-1290
- Arzt, E.¹ Ashby, M.F.²

84
- 0020735466
- V. C. Nardone and J. K. Tien: Scr. Mater., 1983, 17, 467-470.
- (1983) Scr. Mater. , vol.17 , pp. 467-470
- Nardone, V.C.¹ Tien, J.K.²

85
- 0022128260
- J. H. Schroder and E. Arzt: Scr. Mater., 1985, 19, 1129-1134.
- (1985) Scr. Mater. , vol.19 , pp. 1129-1134
- Schroder, J.H.¹ Arzt, E.²

86
- 0021465850
- D. Srolovitz, M. J. Luton, R. Petkovic-Luton, D. M. Barnett and W. D. Nix: Acta Metall., 1984, 32, 1079-1088.
- (1984) Acta Metall. , vol.32 , pp. 1079-1088
- Srolovitz, D.¹ Luton, M.J.² Petkovic-Luton, R.³ Barnett, D.M.⁴ Nix, W.D.⁵

87
- 0039853925
- E. Arzt and D. Wilkinson: Acta Metall., 1986, 34, 1893-1898.
- (1986) Acta Metall. , vol.34 , pp. 1893-1898
- Arzt, E.¹ Wilkinson, D.²

88
- 0023995642
- J. Rosler and E. Arzt: Acta. Metall. Mater., 1988, 36, 1043-1051.
- (1988) Acta. Metall. Mater. , vol.36 , pp. 1043-1051
- Rosler, J.¹ Arzt, E.²

89
- 0018984071
- H. Luthy, A. K. Miller and O. D. Sherby: Acta. Metall., 1980, 28, 169-178.
- (1980) Acta. Metall. , vol.28 , pp. 169-178
- Luthy, H.¹ Miller, A.K.² Sherby, O.D.³

90
- 0000108634
- O. D. Sherby and P. M. Burke: Progr. Mater. Sci., 1967, 1, 325.
- (1967) Progr. Mater. Sci. , vol.1 , pp. 325
- Sherby, O.D.¹ Burke, P.M.²

91
- 0019632644
- O. A. Ruano, A. K. Miller and O. D. Sherby: Mater. Sci. Eng., 1981, 51, 9-16.
- (1981) Mater. Sci. Eng. , vol.51 , pp. 9-16
- Ruano, O.A.¹ Miller, A.K.² Sherby, O.D.³

92
- 0003539082
- H. E. Cline and T. H. Alden: Trans. AIME, 1967, 239, 710-714.
- (1967) Trans. AIME , vol.239 , pp. 710-714
- Cline, H.E.¹ Alden, T.H.²

93
- 0016496281
- F. W. Crossman and M. F. Ashby: Acta. Metall., 1975, 23, 425-440.
- (1975) Acta. Metall. , vol.23 , pp. 425-440
- Crossman, F.W.¹ Ashby, M.F.²

94
- 0030215556
- D. J. Xie, Y. C. Chan and J. K. Lai: IEEE Trans. CPMT A, 1996, 19A, 669-678.
- (1996) IEEE Trans. CPMT A , vol.19 A , pp. 669-678
- Xie, D.J.¹ Chan, Y.C.² Lai, J.K.³

95
- 0024887608
- D. R. Frear: IEEE Trans. CHMT, 1989, 12, 492-4501.
- (1989) IEEE Trans. CHMT , vol.12 , pp. 492-4501
- Frear, D.R.¹

96
- 0027607486
- H. D. Solomon: J. Electron. Packag., 1993, 115, 173-179.
- (1993) J. Electron. Packag. , vol.115 , pp. 173-179
- Solomon, H.D.¹

97
- 0029324150
- L. C. Wen and R. G. Ross: J. Electron. Packag., 1995, 117, 109-115.
- (1995) J. Electron. Packag. , vol.117 , pp. 109-115
- Wen, L.C.¹ Ross, R.G.²

98
- 0024684623
- W. Engelmaier, and A. I. Attarwala: IEEE Trans. CHMT, 1989, 12, 284-296.
- (1989) IEEE Trans. CHMT , vol.12 , pp. 284-296
- Engelmaier, W.¹ Attarwala, A.I.²

99
- 0033222086
- Y. Kariya, Y. Hirata and M. Otsuka: J. Electron. Mater., 1999, 28, 1263-1269.
- (1999) J. Electron. Mater. , vol.28 , pp. 1263-1269
- Kariya, Y.¹ Hirata, Y.² Otsuka, M.³

100
- 0942266961
- M. Farooq, C. Goldsmith, R. Jackson and G. Martin: J. Electron. Mater., 2003, 32, 1421-1425.
- (2003) J. Electron. Mater. , vol.32 , pp. 1421-1425
- Farooq, M.¹ Goldsmith, C.² Jackson, R.³ Martin, G.⁴

101
- 40549124356
- R. S. Sidhu and N. Chawla, Metall. Mater. Trans. A, 2008, 39A, 799-810.
- (2008) Metall. Mater. Trans. A , vol.39 A , pp. 799-810
- Sidhu, R.S.¹ Chawla, N.²

102
- 17644401701
- Y. L. Shen, N. Chawla, E. S. Ege and X. Deng: Acta Mater., 2005, 53, 2633-2642.
- (2005) Acta Mater. , vol.53 , pp. 2633-2642
- Shen, Y.L.¹ Chawla, N.² Ege, E.S.³ Deng, X.⁴

103
- 0036739119
- J. G. Lee, F. Guo, S. Choi, K. N. Subramanian, T. R. Bieler and J. P. Lucas: J. Electron. Mater., 2002, 31, 946-952.
- (2002) J. Electron. Mater. , vol.31 , pp. 946-952
- Lee, J.G.¹ Guo, F.² Choi, S.³ Subramanian, K.N.⁴ Bieler, T.R.⁵ Lucas, J.P.⁶

104
- 0038498832
- J. G. Lee and K. N. Subramanian: J. Electron. Mater., 2003, 32, 523-530.
- (2003) J. Electron. Mater. , vol.32 , pp. 523-530
- Lee, J.G.¹ Subramanian, K.N.²

105
- 15344339799
- H. Rhee, K. N. Subramanian and A. Lee: J. Mater. Sci. Mater. Electron., 2005, 16, 169-176.
- (2005) J. Mater. Sci. Mater. Electron. , vol.16 , pp. 169-176
- Rhee, H.¹ Subramanian, K.N.² Lee, A.³

106
- 0036540441
- S. Choi, J. G. Lee, K. N. Subramanian, J. P. Lucas and T. R. Bieler: J. Electron. Mater., 2002, 31, 292-297.
- (2002) J. Electron. Mater. , vol.31 , pp. 292-297
- Choi, S.¹ Lee, J.G.² Subramanian, K.N.³ Lucas, J.P.⁴ Bieler, T.R.⁵

107
- 0034295794
- S. Choi, K. N. Subramanian, J. P. Lucas and T. R. Bieler: J. Electron. Mater., 2000, 29, 1249-1257.
- (2000) J. Electron. Mater. , vol.29 , pp. 1249-1257
- Choi, S.¹ Subramanian, K.N.² Lucas, J.P.³ Bieler, T.R.⁴

108
- 14544308382
- A. U. Telang and T. R. Bieler: Scr. Mater., 2005, 52, 1027-1031.
- (2005) Scr. Mater. , vol.52 , pp. 1027-1031
- Telang, A.U.¹ Bieler, T.R.²

109
- 1542397798
- K. N. Subramanian and J. G. Lee: J. Mater. Sci., 2004, 15, 235-240.
- (2004) J. Mater. Sci. , vol.15 , pp. 235-240
- Subramanian, K.N.¹ Lee, J.G.²

110
- 11344291942
- A. U. Telang, T. R. Bieler, J. P. Lucas, K. N. Subramanian, L. P. Lehman and Y. Xing: J. Electron. Mater., 2004, 33, 1412-1423.
- (2004) J. Electron. Mater. , vol.33 , pp. 1412-1423
- Telang, A.U.¹ Bieler, T.R.² Lucas, J.P.³ Subramanian, K.N.⁴ Lehman, L.P.⁵ Xing, Y.⁶

111
- 0942288659
- A. U. Telang, T. R. Bieler, D. E. Mason and K. N. Subramanian: J. Electron. Mater. 2003, 32, 1455-1462.
- (2003) J. Electron. Mater. , vol.32 , pp. 1455-1462
- Telang, A.U.¹ Bieler, T.R.² Mason, D.E.³ Subramanian, K.N.⁴

112
- 0017923252
- K. Honda: Jpn J. Appl. Phys., 1978, 17, 33-41.
- (1978) Jpn J. Appl. Phys. , vol.17 , pp. 33-41
- Honda, K.¹

113
- 0023331382
- K. Honda: Jpn J. Appl. Phys., 1987, 26, 637-638.
- (1987) Jpn J. Appl. Phys. , vol.26 , pp. 637-638
- Honda, K.¹

114
- 0018431498
- K. Honda: Jpn J. Appl. Phys., 1979, 18, 215-224.
- (1979) Jpn J. Appl. Phys. , vol.18 , pp. 215-224
- Honda, K.¹

115
- 33746600243
- R. W. Vook: Acta Metall., 1964, 12, 197-207.
- (1964) Acta Metall. , vol.12 , pp. 197-207
- Vook, R.W.¹

116
- 0016646782
- R. Fiedler and I. Vagera: Phy. Status Solidi A, 1975, 32A, 419-424.
- (1975) Phy. Status Solidi A , vol.32 A , pp. 419-424
- Fiedler, R.¹ Vagera, I.²

117
- 23144455436
- M. A. Matin, E. W. C. Coenen, W. P. Vellinga and M. G. D. Geers: Scr. Mater., 2005, 53, 927-932.
- (2005) Scr. Mater. , vol.53 , pp. 927-932
- Matin, M.A.¹ Coenen, E.W.C.² Vellinga, W.P.³ Geers, M.G.D.⁴

118
- 33746597535
- M. A. Matin, W. P. Vellinga and M. G. D. Geers: Mater. Sci. Eng. A, 2006, A431, 166-174.
- (2006) Mater. Sci. Eng. A , vol.A431 , pp. 166-174
- Matin, M.A.¹ Vellinga, W.P.² Geers, M.G.D.³

119
- 33845896801
- Mater. Sci. Eng. A
- M. A. Matin, W. P. Vellinga and M. G. D. Geers: Mater. Sci. Eng. A, 2007, A445-446, 73-85.
- (2007) A445-446 , pp. 73-85
- Matin, M.A.¹ Vellinga, W.P.² Geers, M.G.D.³

120
- 33845568149
- San Diego, CA, USA, June IEEE
- T. R. Bieler, H. Jiang, L. P. Lehman, T. Kirkpatrick and E. J. Cotts: Proc. Conf. on 'Electronic components and technology', San Diego, CA, USA, June 2006, IEEE, 1462-1467.
- (2006) Proc. Conf. on 'Electronic Components and Technology' , pp. 1462-1467
- Bieler, T.R.¹ Jiang, H.² Lehman, L.P.³ Kirkpatrick, T.⁴ Cotts, E.J.⁵

121
- 0001481987
- L. S. Goldmann: IBM J. Res. Develop., 1969, 13, 251-265.
- (1969) IBM J. Res. Develop. , vol.13 , pp. 251-265
- Goldmann, L.S.¹

122
- 0001481981
- K. C. Norris and A. H. Landzberg: IBM J. Res. Develop., 1969, 13, 266-271.
- (1969) IBM J. Res. Develop. , vol.13 , pp. 266-271
- Norris, K.C.¹ Landzberg, A.H.²

123
- 0029227383
- Las Vegas, NV, USA, May IEEE
- R. N. Master, M. S. Cole, G. B. Martin and A. Caron: Proc. Conf. on 'Electronic components and technology', Las Vegas, NV, USA, May 1995, IEEE, 925-929.
- (1995) Proc. Conf. on 'Electronic Components and Technology' , pp. 925-929
- Master, R.N.¹ Cole, M.S.² Martin, G.B.³ Caron, A.⁴

124
- 0942299011
- I. Shohji, H. Mori and Y. Orii: Microelectron. Reliab., 2004, 44, 269-274.
- (2004) Microelectron. Reliab. , vol.44 , pp. 269-274
- Shohji, I.¹ Mori, H.² Orii, Y.³

125
- 2942546514
- J. E. Field, S. M. Walley, W. G. Proud, H. T. Goldrein and C. R. Siviour: Int. J. Impact Eng., 2004, 30, 725-775.
- (2004) Int. J. Impact Eng. , vol.30 , pp. 725-775
- Field, J.E.¹ Walley, S.M.² Proud, W.G.³ Goldrein, H.T.⁴ Siviour, C.R.⁵

126
- 33646383102
- D. Y. R. Chong, F. X. Che, J. H. L. Pang, K. Ng, J. Y. N. Tan and P. T. H. Low: Microelectron. Reliab., 2006, 46, 1160-1171.
- (2006) Microelectron. Reliab. , vol.46 , pp. 1160-1171
- Chong, D.Y.R.¹ Che, F.X.² Pang, J.H.L.³ Ng, K.⁴ Tan, J.Y.N.⁵ Low, P.T.H.⁶

127
- 24644486662
- Orlando, FL, USA, May-June IEEE
- D. Reiff and E. Bradley: Proc. Conf. on 'Electronic components and technology', Orlando, FL, USA, May-June 2005, IEEE, 1519-1525.
- (2005) Proc. Conf. on 'Electronic Components and Technology' , pp. 1519-1525
- Reiff, D.¹ Bradley, E.²

128
- 10444246545
- Las Vegas, NV, USA, May IEEE
- M. Date, T. Shoji, M. Fujiyoshi, K. Sato and K. N. Tu: Proc. Conf. on 'Electronic components and technology', Las Vegas, NV, USA, May 2004, IEEE, 668-674.
- (2004) Proc. Conf. on 'Electronic Components and Technology' , pp. 668-674
- Date, M.¹ Shoji, T.² Fujiyoshi, M.³ Sato, K.⁴ Tu, K.N.⁵

129
- 33646368168
- K. T. Tsai, F-L. Liu, E. H. Wong and R. Rajoo: Solder. Surf. Mount Technol., 2006, 18, 12-17.
- (2006) Solder. Surf. Mount Technol. , vol.18 , pp. 12-17
- Tsai, K.T.¹ Liu, F.-L.² Wong, E.H.³ Rajoo, R.⁴

130
- 34548740253
- Phoenix, AZ, USA, April IEEE
- R. Pandher and M. Boureghda: Proc. IEEE 45th Ann. Int. Symp. on 'Reliability physics', Phoenix, AZ, USA, April 2007, IEEE, 107-112.
- (2007) Proc. IEEE 45th Ann. Int. Symp. on 'Reliability Physics' , pp. 107-112
- Pandher, R.¹ Boureghda, M.²

131
- 24644432659
- Orlando, FL, USA, June IEEE
- K. Newman: Proc. 55th Conf. on 'Electronic components and technology', Orlando, FL, USA, June 2005, IEEE, 1194-1200.
- (2005) Proc. 55th Conf. on 'Electronic Components and Technology' , pp. 1194-1200
- Newman, K.¹

132
- 31044432819
- J. Y. H. Chia, B. Cotterell and T. C. Chai: Mater. Sci. Eng. A, 2006, A417, 259-274.
- (2006) Mater. Sci. Eng. A , vol.A417 , pp. 259-274
- Chia, J.Y.H.¹ Cotterell, B.² Chai, T.C.³

133
- 71049177506
- Albuquerque, NM, USA
- B. L. Boyce and T. B. Crenshaw: SAND2005-5678, Sandia National Laboratories, Albuquerque, NM, USA, 2005.
- (2005) SAND2005-5678, Sandia National Laboratories
- Boyce, B.L.¹ Crenshaw, T.B.²

134
- 71049188871
- to be published
- K. E. Yazzie, H. Fei, H. Jiang and N. Chawla: J. Electron. Mater., 2009, to be published.
- (2009) J. Electron. Mater.
- Yazzie, K.E.¹ Fei, H.² Jiang, H.³ Chawla, N.⁴

135
- 0004328695
- 595-603
- D. S., D. W. Kim, P. Liu, H. Kim, J. A. Weninger, C. M. Kumara, A. Prasad, B. W. Grimsley and H. B. Tejad: Mater. Sci. Eng. A, 2007, A460-461, 595-603.
- (2007) Mater. Sci. Eng. A
- Kim, D.S.D.W.¹ Liu, P.² Kim, H.³ Weninger, J.A.⁴ Kumara, C.M.⁵ Prasad, A.⁶ Grimsley, B.W.⁷ Tejad, H.B.⁸

136
- 34047129644
- Y. Liu, S. Gale and R. W. Johnson: IEEE Trans. Electron. Packag. Manuf., 2007, 30, 63-73.
- (2007) IEEE Trans. Electron. Packag. Manuf. , vol.30 , pp. 63-73
- Liu, Y.¹ Gale, S.² Johnson, R.W.³

137
- 33947194016
- T. T. Mattila, P. Marjamäki and J. K. Kivilahti: IEEE Trans. Electron. Packag. Manuf., 2006, 29, 787-795.
- (2006) IEEE Trans. Electron. Packag. Manuf. , vol.29 , pp. 787-795
- Mattila, T.T.¹ Marjamäki, P.² Kivilahti, J.K.³

138
- 34447265528
- J.-M. Song, J.-J. Lin, C.-F. Huang and H.-Y. Chuang: Mater. Sci. Eng. A, 2007, A466, 9-17.
- (2007) Mater. Sci. Eng. A , vol.A466 , pp. 9-17
- Song, J.-M.¹ Lin, J.-J.² Huang, C.-F.³ Chuang, H.-Y.⁴

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