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Journal of Electronic Materials

Volumn 38, Issue 11, 2009, Pages 2353-2361

Tin whisker growth on the surface of sn-0.7Cu lead-free solder with a rare earth (Nd) addition

(2) Liu, Meng a Xian, Ai Ping a

a INSTITUTE OF METAL RESEARCH (China)

Author keywords

Alloy; Crystal growth; Nd; Sn; Soldering

Indexed keywords

AMBIENT CONDITIONS; AVERAGE GROWTH RATE; BEARING ALLOYS; INCUBATION TIME; LEAD FREE SOLDERS; ND; SN; SOLDER ALLOYS; TIN WHISKER; WHISKER GROWTH;

ALLOYS; BEARINGS (STRUCTURAL); COPPER ALLOYS; CRYSTAL GROWTH; CRYSTALLIZATION; GRAIN BOUNDARIES; LEAD; NEODYMIUM; RARE EARTH ADDITIONS; RARE EARTHS; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 70349856146 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0926-9 Document Type: Article

Times cited : (38)

References (25)

1
- 42349113410
- Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder
- DOI 10.2320/matertrans.MBW200713
- K Nogita CM Gourlay J Read T Nishimura S Suenaga AK Dahle 2008 Mater. Trans. 49 443 10.2320/matertrans.MBW200713 1:CAS:528:DC%2BD1cXltlajt7s%3D (Pubitemid 351554857)
- (2008) Materials Transactions , vol.49 , Issue.3 , pp. 443-448
- Nogita, K.¹ Gourlay, C.M.² Read, J.³ Nishimura, T.⁴ Suenaga, S.⁵ Dahle, A.K.⁶

2
- 70349851405
- T Nishimura 2002 IEICE Trans. Electron. J85-C 961
- (2002) IEICE Trans. Electron. , vol.J85-C , pp. 961
- Nishimura, T.¹

3
- 0036477472
- 10.1557/JMR.2002.0036 2002JMatR.17.263C 1:CAS:528:DC%2BD38Xjt1amu70%3D
- WT Chen CE Ho CR Kao 2002 J. Mater. Res. 17 263 10.1557/JMR.2002.0036 2002JMatR..17..263C 1:CAS:528:DC%2BD38Xjt1amu70%3D
- (2002) J. Mater. Res. , vol.17 , pp. 263
- Chen, W.T.¹ Ho, C.E.² Kao, C.R.³

4
- 42649108100
- Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applications
- DOI 10.1016/j.jallcom.2007.03.028, PII S092583880700624X
- C Andersson P Sun J Liu 2008 J. Alloys Compd. 457 97 10.1016/j.jallcom. 2007.03.028 1:CAS:528:DC%2BD1cXls12hu7g%3D (Pubitemid 351601666)
- (2008) Journal of Alloys and Compounds , vol.457 , Issue.1-2 , pp. 97-105
- Andersson, C.¹ Sun, P.² Liu, J.³

5
- 70349872246
- N. Zhao, H.T. Ma, and L. Wang, International Symposium on High Density Packaging and Microsystem Integration (2007), p. 183.
- (2007) International Symposium on High Density Packaging and Microsystem Integration , pp. 183
- Zhao, N.¹ Ma, H.T.² Wang, L.³

6
- 70349858796
- KR366131-B; JP2003154486-A. Derwent Primary Accession Number: 2002-597187
- J.P. Jung, J.O. Lee, Z.Y. Li, and Z.Z. Zeng, Low Melting Point Lead-free Solder with Lower Dross KR2002020663-A; KR366131-B; JP2003154486-A. Derwent Primary Accession Number: 2002-597187.
- Low Melting Point Lead-free Solder with Lower Dross KR2002020663-A
- Jung, J.P.¹ Lee, J.O.² Li, Z.Y.³ Zeng, Z.Z.⁴

7
- 33845716824
- Rare-earth additions to lead-free electronic solders
- DOI 10.1007/s10854-006-9022-6
- CML Wu YW Wang 2007 J. Mater. Sci. Mater. Electron. 18 77 10.1007/s10854-006-9022-6 1:CAS:528:DC%2BD28XhtlWntLrJ (Pubitemid 44963678)
- (2007) Journal of Materials Science: Materials in Electronics , vol.18 , Issue.1-3 , pp. 77-91
- Wu, C.M.L.¹ Wong, Y.W.²

8
- 0036738909
- 10.1007/s11664-002-0185-5 2002JEMat.31.928W 1:CAS:528: DC%2BD38XntFOktLY%3D
- CML Wu DQ Yu CMT Law L Wang 2002 J. Electron. Mater. 31 928 10.1007/s11664-002-0185-5 2002JEMat..31..928W 1:CAS:528:DC%2BD38XntFOktLY%3D
- (2002) J. Electron. Mater. , vol.31 , pp. 928
- Wu, C.M.L.¹ Yu, D.Q.² Law, C.M.T.³ Wang, L.⁴

9
- 70349860778
- China patent CN1974109-A, 2008-C37653
- X. Liu, China patent CN1974109-A, 2008-C37653.
- Liu, X.¹

10
- 33748790378
- Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints
- DOI 10.1016/j.scriptamat.2006.08.024, PII S1359646206006075
- TH Chuang 2006 Scr. Mater. 55 983 10.1016/j.scriptamat.2006.08.024 1:CAS:528:DC%2BD28XpvVyit7o%3D 2187846 (Pubitemid 44416310)
- (2006) Scripta Materialia , vol.55 , Issue.11 , pp. 983-986
- Chuang, T.-H.¹

11
- 33748693701
- 10.1007/s11664-006-0208-8 2006JEMat.35.1621C 1:CAS:528: DC%2BD28Xpt1ehu7s%3D
- TH Chuang SF Yen 2006 J. Electron. Mater. 35 1621 10.1007/s11664-006- 0208-8 2006JEMat..35.1621C 1:CAS:528:DC%2BD28Xpt1ehu7s%3D
- (2006) J. Electron. Mater. , vol.35 , pp. 1621
- Chuang, T.H.¹ Yen, S.F.²

12
- 33750352290
- Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloy
- DOI 10.1016/j.scriptamat.2006.08.061, PII S1359646206006488
- TH Chuang HJ Lin CC Chi 2007 Scr. Mater. 56 45 10.1016/j.scriptamat.2006. 08.061 2007JEMat..36...45C 1:CAS:528:DC%2BD28XhtFehtr7M (Pubitemid 44633771)
- (2007) Scripta Materialia , vol.56 , Issue.1 , pp. 45-48
- Chuang, T.H.¹ Lin, H.J.² Chi, C.C.³

13
- 34547681726
- Spontaneous growth of tin whiskers on tin-rare-earth alloys
- DOI 10.1080/09500830701432607, PII 780541306
- B Jiang AP Xian 2007 Philos. Mag. Lett. 87 657 10.1080/09500830701432607 2007PMagL..87..657J 1:CAS:528:DC%2BD2sXosVSntLw%3D (Pubitemid 47209884)
- (2007) Philosophical Magazine Letters , vol.87 , Issue.9 , pp. 657-662
- Jiang, B.¹ Xian, A.-P.²

14
- 0009704234
- KG Compton A Mendizza SM Arnold 1951 Corrosion 7 327
- (1951) Corrosion , vol.7 , pp. 327
- Compton, K.G.¹ Mendizza, A.² Arnold, S.M.³

15
- 70349851488
- B. Nordwall, Aviation Week and Space Technology. 65 (1986).
- (1986) Aviation Week and Space Technology , vol.65
- Nordwall, B.¹

16
- 1542373474
- J. Richardson and B. Lasely, Proceedings 1992 Government Microcircuit Applications Conference (1992), p. 119.
- (1992) Proceedings 1992 Government Microcircuit Applications Conference , pp. 119
- Richardson, J.¹ Lasely, B.²

17
- 84864157050
- Satellite News Digest, HS601 satellite Failures
- Satellite News Digest, HS601 satellite Failures. http://www.sat-index. com/failures.

18
- 0041648784
- 1:CAS:528:DyaL1MXitF2rurs%3D
- VN Eremenko MV Bulanova PS Martsenyuk V.E. Listovnichii 1988 Ukr. Khim. Zh. 54 1240 1:CAS:528:DyaL1MXitF2rurs%3D
- (1988) Ukr. Khim. Zh. , vol.54 , pp. 1240
- Eremenko, V.N.¹ Bulanova, M.V.² Martsenyuk, P.S.³ Listovnichii, V.E.⁴

19
- 33845718807
- Sn-whiskers: Truths and myths
- DOI 10.1007/s10854-006-9030-6
- JW Osenbach JM Delucca BD Potteiger A Amin FA Baiocchi 2007 J. Mater. Sci. Mater. Electron. 18 283 10.1007/s10854-006-9030-6 1:CAS:528: DC%2BD28XhtlWntLvE (Pubitemid 44963692)
- (2007) Journal of Materials Science: Materials in Electronics , vol.18 , Issue.1-3 , pp. 283-305
- Osenbach, J.W.¹ DeLucca, J.M.² Potteiger, B.D.³ Amin, A.⁴ Baiocchi, F.A.⁵

20
- 0006041570
- R.H. Doremus B.W. Roberts (eds). Wiley New York
- W.C. Ellis, D.F. Gibbons, and R.C. Treuting, Growth and Perfection of Crystals, ed. R.H. Doremus and B.W. Roberts (New York: Wiley, 1958), pp. 102-120.
- (1958) Growth and Perfection of Crystals , pp. 102-120
- Ellis, W.C.¹ Gibbons, D.F.² Treuting, R.C.³

21
- 84864155342
- JEDEC Standard JESD22A121.01
- JEDEC Standard JESD22A121.01, http://www.jedec.org/download/search/ 22a121.pdf.

22
- 33847413618
- Observations of ribbon-like whiskers on tin finish surface
- DOI 10.1007/s10854-006-9099-y
- B Jiang AP Xian 2007 J. Mater. Sci. Mater. Electron. 18 513 10.1007/s10854-006-9099-y 1:CAS:528:DC%2BD2sXitVKjt7g%3D (Pubitemid 46336203)
- (2007) Journal of Materials Science: Materials in Electronics , vol.18 , Issue.5 , pp. 513-518
- Jiang, B.¹ Xian, A.-P.²

23
- 0037999858
- 10.1557/JMR.2003.0076 2003JMatR.18.585L 1:CAS:528:DC%2BD3sXitlCkt7c%3D
- JB LeBret MG Norton 2003 J. Mater. Res. 18 585 10.1557/JMR.2003.0076 2003JMatR..18..585L 1:CAS:528:DC%2BD3sXitlCkt7c%3D
- (2003) J. Mater. Res. , vol.18 , pp. 585
- Lebret, J.B.¹ Norton, M.G.²

24
- 0032083872
- 10.1016/S1359-6454(98)00045-7 1:CAS:528:DyaK1cXktlWksbo%3D
- B-Z Lee DN Lee 1998 Acta Mater. 46 3701 10.1016/S1359-6454(98)00045-7 1:CAS:528:DyaK1cXktlWksbo%3D
- (1998) Acta Mater. , vol.46 , pp. 3701
- Lee, B.-Z.¹ Lee, D.N.²

25
- 0000643191
- 1994PhRvB.49.2030T 1:CAS:528:DyaK2cXhsVWit7g%3D
- KN Tu 1994 Phys. Rev. B: Condens. Matter Mater. Phys. 49 2030 1994PhRvB..49.2030T 1:CAS:528:DyaK2cXhsVWit7g%3D
- (1994) Phys. Rev. B: Condens. Matter Mater. Phys. , vol.49 , pp. 2030
- Tu, K.N.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.