Nucleation control and thermal aging resistance of near-eutectic Sn-Ag-Cu-X solder joints by alloy design

Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2770-2779

  Anderson, Iver E ^a,b   Walleser, Jason W ^b   Harringa, Joel L ^a   Laabs, Fran ^a   Kracher, Alfred ^a  

^a IOWA STATE UNIVERSITY   (United States)

^b Iowa State University   (United States)

Author keywords

(Zn, Mn, Al) additions; Ag 3Sn blades; Pb free solder; Shear strength; Thermal aging; Undercooling

Indexed keywords

(ZN, MN, AL) ADDITIONS; AG 3SN BLADES; ALLOY DESIGNS; DUCTILE FAILURES; MICROSTRUCTURE ANALYSIS; NUCLEATION CONTROL; PB FREE SOLDERS; SHEAR TESTING; SN-3.5AG; SN-AG-CU; SOLDER JOINTS;

ALUMINUM; COPPER ALLOYS; EUTECTICS; LEAD; MANGANESE; MANGANESE COMPOUNDS; MICROSTRUCTURE; QUALITY ASSURANCE; SHEAR STRENGTH; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; THERMAL AGING; TIN ALLOYS; UNDERCOOLING; ZINC;

TIN;

EID: 72549094030     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0936-7     Document Type: Article

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