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Journal of Electronic Materials

Volumn 40, Issue 1, 2011, Pages 62-70

Effects of Co alloying and size on solidification and interfacial reactions in Sn-57 wt.%Bi-(Co)/Cu couples

(2) Huang, Yu Chih a Chen, Sinn Wen a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Bi; Co; Interfacial reaction; size effect; Sn; solidification

Indexed keywords

BI; CO; INTERFACIAL REACTION; SIZE EFFECTS; SN;

ADDITION REACTIONS; DISSOLUTION; SOLDERING ALLOYS; SOLIDIFICATION;

TIN;

EID: 78650719657 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1386-y Document Type: Article

Times cited : (29)

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