Nucleation kinetics and solidification temperatures of SnAgCu interconnections during reflow process

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 4, 2006, Pages 778-785

  Yu, Hao ^b   Kivilahti, Jorma K ^a,b  

^a IEEE

^b AALTO UNIVERSITY   (Finland)

Author keywords

Interconnections; Kinetic stimulation; Lead free solder; Nucleation; Reliability; Solidification temperature

Indexed keywords

COMPUTER SIMULATION; INTERCONNECTION NETWORKS; KINETIC THEORY; NUCLEATION; SOLIDIFICATION;

KINETIC STIMULATION; LEAD FREE SOLDERS; SOLIDIFICATION TEMPERATURE;

TIN COMPOUNDS;

EID: 33947205124     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.885946     Document Type: Article

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