SCOPUS 정보 검색 플랫폼

Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 8, 2011, Pages 1181-1187

Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates

(5) Wu, R W a Tsao, L C b Chang, S Y c Jain, C C d Chen, R S a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

b NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

c NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

d NATIONAL TAIWAN UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AG SUBSTRATE; DIFFUSION CONTROLLED; INTERFACIAL MICROSTRUCTURE; KINETICS ANALYSIS; LAYER GROWTH; PROCESSING CONDITION; SCALLOP-SHAPED; SOLDERING REACTIONS;

ACTIVATION ENERGY; GROWTH KINETICS; INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; SOLDERING; SOLDERING ALLOYS; TIN;

SILVER;

EID: 80051547946 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-010-0281-x Document Type: Article

Times cited : (14)

References (38)

1
- 0033747819
- M Abtew G Selvaduray 2000 Lead Free Solder Microelectron A27 95 141
- (2000) Lead Free Solder Microelectron , vol.27 , pp. 95-141
- Abtew, M.¹ Selvaduray, G.²

2
- 0029193520
- 1:CAS:528:DyaK2MXmvVGjsLY%3D
- J Glazer 1995 Inter. Mater. Rev 40 65 92 1:CAS:528:DyaK2MXmvVGjsLY%3D
- (1995) Inter. Mater. Rev , vol.40 , pp. 65-92
- Glazer, J.¹

3
- 78651352045
- doi:10.1016/j.jallcom.2010.11.010
- L.C. Tsao, J. Alloy. Comp (2010). doi: 10.1016/j.jallcom.2010.11.010
- (2010) J. Alloy. Comp
- Tsao, L.C.¹

4
- 80051546649
- doi:10.1007/s10854-010-0253-1
- T.H. Chuang, M.W. Wu, S.Y. Chang, C.C. Ping, L.C. Tsao, J. Mater Sci. Mater Electron (2010). doi: 10.1007/s10854-010-0253-1
- (2010) J. Mater Sci. Mater Electron
- Chuang, T.H.¹ Wu, M.W.² Chang, S.Y.³ Ping, C.C.⁴ Tsao, L.C.⁵

5
- 70350068088
- 10.1016/j.matdes.2009.08.008 1:CAS:528:DC%2BD1MXhtlWltbrE
- LC Tsao SY Chuang 2010 Mater Des. 31 990 993 10.1016/j.matdes.2009.08.008 1:CAS:528:DC%2BD1MXhtlWltbrE
- (2010) Mater Des. , vol.31 , pp. 990-993
- Tsao, L.C.¹ Chuang, S.Y.²

6
- 77954141951
- 10.1016/j.matdes.2010.04.033 1:CAS:528:DC%2BC3cXos1Wqur4%3D
- LC Tsao SY Chang CI Lee WH Sun CH Huang 2010 Mater Des. 31 4831 4835 10.1016/j.matdes.2010.04.033 1:CAS:528:DC%2BC3cXos1Wqur4%3D
- (2010) Mater Des. , vol.31 , pp. 4831-4835
- Tsao, L.C.¹ Chang, S.Y.² Lee, C.I.³ Sun, W.H.⁴ Huang, C.H.⁵

7
- 0036503099
- 10.1007/s11664-002-0202-8 1:CAS:528:DC%2BD38XitF2nsrw%3D
- MD Cheng SS Wang TH Chuang 2002 J. Electron Mater 31 171 177 10.1007/s11664-002-0202-8 1:CAS:528:DC%2BD38XitF2nsrw%3D
- (2002) J. Electron Mater , vol.31 , pp. 171-177
- Cheng, M.D.¹ Wang, S.S.² Chuang, T.H.³

8
- 33846292544
- Effect of Cu addition on interfacial reaction between Sn-9Zn solder and Ag
- DOI 10.1557/jmr.2006.0369
- YW Yen CC Jao C Lee 2006 J. Mater Res 21 2986 2990 10.1557/jmr.2006.0369 1:CAS:528:DC%2BD28XhtlejsbbL (Pubitemid 46117167)
- (2006) Journal of Materials Research , vol.21 , Issue.12 , pp. 2986-2990
- Yen, Y.-W.¹ Jao, C.-C.² Lee, C.³

9
- 0029389631
- 10.1007/BF02655465 1:CAS:528:DyaK2MXosFygt78%3D
- W Yang LE Felton RW Messler Jr 1995 J. Electron Mater 24 1465 1472 10.1007/BF02655465 1:CAS:528:DyaK2MXosFygt78%3D
- (1995) J. Electron Mater , vol.24 , pp. 1465-1472
- Yang, W.¹ Felton, L.E.² Messler Jr., R.W.³

10
- 0036692934
- 10.1361/105994902770343872 1:CAS:528:DC%2BD38XmvFClsrs%3D
- TL Su LC Tsao SY Chang TH Chuang 2002 JMEP 11 365 368 10.1361/105994902770343872 1:CAS:528:DC%2BD38XmvFClsrs%3D
- (2002) JMEP , vol.11 , pp. 365-368
- Su, T.L.¹ Tsao, L.C.² Chang, S.Y.³ Chuang, T.H.⁴

11
- 0036810736
- Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
- DOI 10.1361/105994902770343692
- TL Su LC Tsao SY Chang TH Chuang 2002 JMEP 11 481 486 10.1361/105994902770343692 1:CAS:528:DC%2BD38Xos1yitLY%3D (Pubitemid 35369880)
- (2002) Journal of Materials Engineering and Performance , vol.11 , Issue.5 , pp. 481-486
- Su, T.L.¹ Tsao, L.C.² Chang, S.Y.³ Chuang, T.H.⁴

12
- 0003831179
- 2nd edn. Electrochemical Publications, Ltd Ayr, UK
- R.J.K. Wassink, Soldering in Electronics, 2nd edn. (Electrochemical Publications, Ltd, Ayr, UK, 1989), pp. 215-216
- (1989) Soldering in Electronics , pp. 215-216
- Wassink, R.J.K.¹

13
- 33845694955
- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications
- DOI 10.1007/s10854-006-9011-9
- IE Anderson 2007 J. Mater Sci. Mater Electron 18 55 76 10.1007/s10854-006-9011-9 1:CAS:528:DC%2BD28XhtlWntLvJ (Pubitemid 44963677)
- (2007) Journal of Materials Science: Materials in Electronics , vol.18 , Issue.1-3 , pp. 55-76
- Anderson, I.E.¹

14
- 51249164034
- 10.1007/BF02651361 1:CAS:528:DyaK2cXltlyku70%3D
- J Glazer 1994 J. Electron Mater 23 693 700 10.1007/BF02651361 1:CAS:528:DyaK2cXltlyku70%3D
- (1994) J. Electron Mater , vol.23 , pp. 693-700
- Glazer, J.¹

15
- 0034240674
- Formation and growth of interfacial intermetallic layers in eutectic Sn-Ag solder and its composite solder joints
- DOI 10.1023/A:1008968518512
- S Choi JP Lucas KN Subramanian TR Bieler 2000 J. Mater Sci. Mater Electron 11 497 502 10.1023/A:1008968518512 1:CAS:528:DC%2BD3MXktVKnsw%3D%3D (Pubitemid 32076403)
- (2000) Journal of Materials Science: Materials in Electronics , vol.11 , Issue.6 , pp. 497-502
- Choi, S.¹ Lucas, J.P.² Subramanian, K.N.³ Bieler, T.R.⁴

16
- 0033222027
- 10.1007/s11664-999-0159-y 1:CAS:528:DyaK1MXntlKgtrY%3D
- S Choi TR Bieler JP Lucas KN Subramanian 1999 J. Electron Mater 28 1209 1215 10.1007/s11664-999-0159-y 1:CAS:528:DyaK1MXntlKgtrY%3D
- (1999) J. Electron Mater , vol.28 , pp. 1209-1215
- Choi, S.¹ Bieler, T.R.² Lucas, J.P.³ Subramanian, K.N.⁴

17
- 0031185622
- 10.1007/s11664-997-0268-4 1:CAS:528:DyaK2sXksVSqsbc%3D
- DR Flanders EG Jacobs RF Pinizzotto 1997 J. Electron Mater 26 883 887 10.1007/s11664-997-0268-4 1:CAS:528:DyaK2sXksVSqsbc%3D
- (1997) J. Electron Mater , vol.26 , pp. 883-887
- Flanders, D.R.¹ Jacobs, E.G.² Pinizzotto, R.F.³

18
- 3142722694
- 10.1023/B:JMSC.0000033401.38785.73 1:CAS:528:DC%2BD2cXlt1CrsL0%3D
- JW Yoon SB Jung 2004 J. Mater Sci. 39 4211 4217 10.1023/B:JMSC. 0000033401.38785.73 1:CAS:528:DC%2BD2cXlt1CrsL0%3D
- (2004) J. Mater Sci. , vol.39 , pp. 4211-4217
- Yoon, J.W.¹ Jung, S.B.²

19
- 33646560368
- 10.1007/s11661-006-0099-6
- PT Vianco RD Wright PF Hlava JJ Martin 2006 Metall. Mater Trans. A 37 1551 1561 10.1007/s11661-006-0099-6
- (2006) Metall. Mater Trans. A , vol.37 , pp. 1551-1561
- Vianco, P.T.¹ Wright, R.D.² Hlava, P.F.³ Martin, J.J.⁴

20
- 0025550182
- 10.1109/33.62587 1:CAS:528:DyaK3MXhtVOisbk%3D
- M Harada R Satoh 1990 IEEE Trans. Comp Hybrids Manuf. Tech 13 736 742 10.1109/33.62587 1:CAS:528:DyaK3MXhtVOisbk%3D
- (1990) IEEE Trans. Comp Hybrids Manuf. Tech , vol.13 , pp. 736-742
- Harada, M.¹ Satoh, R.²

21
- 0035359916
- 10.1007/s11837-001-0100-1 1:CAS:528:DC%2BD3MXkvFehtLw%3D
- RA Gagliano ME Fine 2001 JOM 53 33 38 10.1007/s11837-001-0100-1 1:CAS:528:DC%2BD3MXkvFehtLw%3D
- (2001) JOM , vol.53 , pp. 33-38
- Gagliano, R.A.¹ Fine, M.E.²

22
- 13444302578
- Effect of indium addition in Sn-rich solder on the dissolution of Cu metallization
- DOI 10.1016/j.jallcom.2004.08.023, PII S0925838804010515
- A Sharif YC Chan 2005 J. Alloy. Comp 390 67 93 10.1016/j.jallcom.2004.08. 023 1:CAS:528:DC%2BD2MXhtV2mu70%3D (Pubitemid 40206173)
- (2005) Journal of Alloys and Compounds , vol.390 , Issue.1-2 , pp. 67-73
- Sharif, A.¹ Chan, Y.C.²

23
- 0035426737
- Interface reaction between copper and molten tin-lead solders
- DOI 10.1016/S1359-6454(01)00146-X, PII S135964540100146X
- KH Prakash T Sritharan 2001 Acta Mater 49 2481 2489 10.1016/S1359- 6454(01)00146-X 1:CAS:528:DC%2BD3MXkvFyju7w%3D (Pubitemid 32621520)
- (2001) Acta Materialia , vol.49 , Issue.13 , pp. 2481-2489
- Prakash, K.H.¹ Sritharan, T.²

24
- 77950073247
- 10.1016/j.actamat.2010.02.018 1:CAS:528:DC%2BC3cXkt1Gqtb0%3D
- JF Li PA Agyakwa CM Johnson 2010 Acta Mater 58 3429 3443 10.1016/j.actamat.2010.02.018 1:CAS:528:DC%2BC3cXkt1Gqtb0%3D
- (2010) Acta Mater , vol.58 , pp. 3429-3443
- Li, J.F.¹ Agyakwa, P.A.² Johnson, C.M.³

25
- 76549124422
- 10.1016/j.jallcom.2009.11.131 1:CAS:528:DC%2BC3cXit1Ckur8%3D
- XY Liu ML Huang YH Zhao CML Wu L Wan 2010 J. Alloy. Compd 492 433 438 10.1016/j.jallcom.2009.11.131 1:CAS:528:DC%2BC3cXit1Ckur8%3D
- (2010) J. Alloy. Compd , vol.492 , pp. 433-438
- Liu, X.Y.¹ Huang, M.L.² Zhao, Y.H.³ Wu, C.M.L.⁴ Wan, L.⁵

26
- 7044265011
- J.H.L. Pang, L. Xu, X.Q. Shi, W. Zhou, S.L. Ngoh, J. Electron Mater 33, 1219-1226 (2004)
- (2004) J. Electron Mater , vol.33 , pp. 1219-1226
- Pang, J.H.L.¹ Xu, L.² Shi, X.Q.³ Zhou, W.⁴ Ngoh, S.L.⁵

27
- 67650421794
- 10.1007/s11664-009-0767-6 1:CAS:528:DC%2BD1MXmvVymtro%3D
- H Schoeller S Bansal A Knobloch D Shaddock J Cho 2009 J. Electron Mater 38 802 809 10.1007/s11664-009-0767-6 1:CAS:528:DC%2BD1MXmvVymtro%3D
- (2009) J. Electron Mater , vol.38 , pp. 802-809
- Schoeller, H.¹ Bansal, S.² Knobloch, A.³ Shaddock, D.⁴ Cho, J.⁵

28
- 77953321995
- 10.1007/s10854-010-0086-y 1:CAS:528:DC%2BC3cXkt1Wqsro%3D
- G Zeng S Xue L Zhang L Gao W Dai J Luo 2010 J. Mater Sci. Mater Electron 21 421 440 10.1007/s10854-010-0086-y 1:CAS:528:DC%2BC3cXkt1Wqsro%3D
- (2010) J. Mater Sci. Mater Electron , vol.21 , pp. 421-440
- Zeng, G.¹ Xue, S.² Zhang, L.³ Gao, L.⁴ Dai, W.⁵ Luo, J.⁶

29
- 36849115861
- 10.1063/1.1708821 1:CAS:528:DyaF28XktValsrs%3D
- BF Dyson 1966 J. Appl. Phys 37 2375 2377 10.1063/1.1708821 1:CAS:528:DyaF28XktValsrs%3D
- (1966) J. Appl. Phys , vol.37 , pp. 2375-2377
- Dyson, B.F.¹

30
- 0000027273
- 10.1103/PhysRevB.21.5447 1:CAS:528:DyaL3cXltVaqtLs%3D
- A Bruson M Gerl 1980 Phys. Rev. B 21 5447 5454 10.1103/PhysRevB.21.5447 1:CAS:528:DyaL3cXltVaqtLs%3D
- (1980) Phys. Rev. B , vol.21 , pp. 5447-5454
- Bruson, A.¹ Gerl, M.²

31
- 33748122359
- 1:CAS:528:DC%2BD28XnvFyksL0%3D
- J Cahoon Y Jiao K Tandon M Chaturvedi 2006 J. Phase Equilib. Diffus 27 325 332 1:CAS:528:DC%2BD28XnvFyksL0%3D
- (2006) J. Phase Equilib. Diffus , vol.27 , pp. 325-332
- Cahoon, J.¹ Jiao, Y.² Tandon, K.³ Chaturvedi, M.⁴

32
- 35448940405
- 10.1063/1.1710127 1:CAS:528:DyaF1cXmsV2q
- BF Dyson TR Anthony D Turnbull 1967 J. Appl. Phys 38 3408 3416 10.1063/1.1710127 1:CAS:528:DyaF1cXmsV2q
- (1967) J. Appl. Phys , vol.38 , pp. 3408-3416
- Dyson, B.F.¹ Anthony, T.R.² Turnbull, D.³

33
- 0000761133
- 10.1103/PhysRev.96.610 1:CAS:528:DyaG2MXhvVGmsw%3D%3D
- CT Tomizuka L Slifkin 1954 Phys. Rev 96 610 615 10.1103/PhysRev.96.610 1:CAS:528:DyaG2MXhvVGmsw%3D%3D
- (1954) Phys. Rev , vol.96 , pp. 610-615
- Tomizuka, C.T.¹ Slifkin, L.²

34
- 70450003283
- L.C. Tsao, S.Y. Chang, W.H. Sun, S.F. Yen, International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)(2009). pp. 886-889
- (2009) International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) , pp. 886-889
- Tsao, L.C.¹ Chang, S.Y.² Sun, W.H.³ Yen, S.F.⁴

35
- 33746869264
- 10.1007/s11664-006-0152-7 1:CAS:528:DC%2BD28XnslCms7s%3D
- N Dariavach P Callahan J Liang R Fournelle 2006 J. Electron Mater 35 1581 1592 10.1007/s11664-006-0152-7 1:CAS:528:DC%2BD28XnslCms7s%3D
- (2006) J. Electron Mater , vol.35 , pp. 1581-1592
- Dariavach, N.¹ Callahan, P.² Liang, J.³ Fournelle, R.⁴

36
- 41149101101
- 10.1088/1742-6596/98/1/012029
- N Zhao X Pan H Ma GC Dong W Lu L Wang 2008 J. Phys. Conf. Ser 98 012029 10.1088/1742-6596/98/1/012029
- (2008) J. Phys. Conf. ser , vol.98 , pp. 012029
- Zhao, N.¹ Pan, X.² Ma, H.³ Dong, G.C.⁴ Lu, W.⁵ Wang, L.⁶

37
- 33845420601
- Scallop formation and dissolution of Cu-Sn intermetallic compound during solder reflow
- DOI 10.1063/1.1445283
- D Ma WD Wang SK Lahiri 2002 J. Appl. Phys 91 3312 3317 10.1063/1.1445283 1:CAS:528:DC%2BD38Xhs1ags78%3D (Pubitemid 34598818)
- (2002) Journal of Applied Physics , vol.91 , Issue.5 , pp. 3312
- Ma, D.¹ Wang, W.D.² Lahiri, S.K.³

38
- 58249134982
- 10.1016/j.jallcom.2008.01.082 1:CAS:528:DC%2BD1MXhtVOmt7o%3D
- HF Zou ZF Zhang 2009 J. Alloy. Compd 469 207 214 10.1016/j.jallcom.2008. 01.082 1:CAS:528:DC%2BD1MXhtVOmt7o%3D
- (2009) J. Alloy. Compd , vol.469 , pp. 207-214
- Zou, H.F.¹ Zhang, Z.F.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.