Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin-lead solder

Materials Letters

Volumn 57, Issue 21, 2003, Pages 3193-3198

  Lin, D C ^a   Wang, G X ^a   Srivatsan, T S ^a   Al Hajri, Meslet ^a   Petraroli, M ^b  

^a The University of Akron   (United States)

^b TIMKEN COMPANY   (United States)

Author keywords

Composite solder; Microhardness; Microstructure; Sn Pb eutectic; Titanium dioxide nanopowders

Indexed keywords

EUTECTICS; HARDNESS TESTING; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; OPTICAL MICROSCOPY; POWDER METALS; TIN ALLOYS;

COMPOSITE SOLDERS;

SOLDERING ALLOYS;

EID: 0038347098     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(03)00023-5     Document Type: Article

References (8)

1. Morris J.W. Jr., Tribula D., Summers T.D.S., Grivas D. John Lau H. The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder Joint Reliability. 1991;Van Nostrand, New York City. Chapter 7.
2. Wu Y., Sees J.A., Pouraghabagher C., Foster L.A., Marshall J.L., Jacobs E.G., Pinizzotto R.F. The formation and growth of intermetallics in composite solder. Journal of Electronic Materials. 22(7):1993;769-777.
3. Marshall J.L., Calderon J., Sees J., Lucey G., Hwang J.S. Composite solders. IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 14(4):1991;698-702.
4. Sastry S.M.L., Frear D.R., Kuo G., Jerina K.L. The properties of composite solders. Yost F.G., Hosking F.M., Frear D.R. The Mechanics of Solder Wetting and Spreading. 1993;Van Nostrand-Reinhold, New York.
5. Reno R.C., Panunto M.J. A Mossbauer study of tin-based intermetallics formed during the manufacture of dispersion-strengthened composite solders. Journal of Electronic Materials. 26(1):1997;12.
6. Marshall J.L., Calderon J. Hard-particle reinforced composite solders: Part 1. Micro-characterization. Soldering & Surface Mount Technology. 26:1997;22-28.
7. Mavoori H., Jin S. New, creep-resistant, low melting point solders with ultrafine oxide dispersions. Journal of Electronic Materials. 27(11):1998;1216-1222.
8. Clough R.B., Patel R., Hwang J.S., Lucey G.K. Proceedings NEPCON West. 1992;1256-1265 Cahners Exhibition Group, Des Plains, IL.