Interfacial reactions and reliability of Sn-Zn-Bi-XCr solder joints with Cu pads

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Shen, Yidong ^a   Hu, Anming ^a   Chen, Xi ^a   Li, Ming ^a   Mao, Dali ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BISMUTH PLATING; BRAZING; CHROMIUM; COPPER; COPPER ALLOYS; ELECTRONICS PACKAGING; SOLDERING ALLOYS; TECHNOLOGY; TIN ALLOYS; WELDING; ZINC;

ELECTRONIC PACKAGING; HIGH-DENSITY PACKAGING; INTERFACIAL REACTIONS; INTERNATIONAL CONFERENCES; LONG-TERM AGEING; SN-8ZN-3BI; SOLDER JOINTS;

TIN;

EID: 52449094425     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4607089     Document Type: Conference Paper

References (14)

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