Solidification behavior of Sn-9Zn-xAg lead-free solder alloys

Materials Science and Engineering: A

Volumn 413-414, Issue , 2005, Pages 312-316

  Tsai, Ying Ling ^a   Hwang, Weng Sing ^a,b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE   (Taiwan)

Author keywords

Intermetallic compound; Lead free solder alloy; Solidification

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; EUTECTICS; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; MICROANALYSIS; SCANNING ELECTRON MICROSCOPY; SILVER; SOLIDIFICATION; TIN ALLOYS; X RAY ANALYSIS;

ELECTRON PROBE MICROANALYSIS; LEAD FREE SOLDER ALLOY; SOLIDIFICATION BEHAVIOR;

SOLDERING ALLOYS;

SOLIDIFICATION;

EID: 29544446219     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.08.185     Document Type: Article

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