Effects of additional elements (Fe, Co, Al) on SnAgCu solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 54-60

  Hutter, Matthias ^a   Schmidt, Ralf ^a   Zerrer, Patrick ^b   Rauschenbach, Steffen ^a   Wittke, Klaus ^a   Scheel, Wolfgang ^a   Reichl, Herbert ^c  

^a FRAUNHOFER IZM   (Germany)

^b ROBERT BOSCH GMBH   (Germany)

^c TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FE LAYER; HIGH RELIABILITY; INTERMETALLIC PHASE; LEAD-FREE SOLDER JOINT; LEAD-FREE SOLDERING; METAL COMPOUNDS; METALLIZATION LAYERS; PHASE FORMS; POWDER PRODUCTION; REFINED MICROSTRUCTURE; REFLOW PROCESS; SAC-SOLDERS; SN-AG-CU; SNAGCU SOLDER; THERMAL FATIGUE PROPERTIES;

ALLOYING; ALLOYING ELEMENTS; ALUMINUM; AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOTIVE INDUSTRY; COBALT COMPOUNDS; CONSUMER ELECTRONICS; GRAIN BOUNDARIES; IRON ALLOYS; LEAD; METAL REFINING; PHOTORESISTS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SILVER; SOLDERING ALLOYS; TIN;

SOLDERING;

EID: 70349653029     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5073996     Document Type: Conference Paper

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