Limitations of nanoparticle enhanced solder pastes for electronics assembly

Proceedings of the IEEE Conference on Nanotechnology

Volumn , Issue , 2012, Pages

  Kotadia, Hiren R ^a,b   Panneerselvam, Arunkumar ^a   Green, Mark A ^a   Mannan, Samjid H ^a  

^a KING'S COLLEGE LONDON   (United Kingdom)

^b BRUNEL UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE APPLICATIONS; INTERMETALLICS; NANOTECHNOLOGY; SOLDERING ALLOYS;

ELECTRONICS ASSEMBLY; NANOPARTICLE TECHNOLOGIES; SOLDER PASTE;

NANOPARTICLES;

EID: 84869159337     PISSN: 19449399     EISSN: 19449380     Source Type: Conference Proceeding    
DOI: 10.1109/NANO.2012.6321891     Document Type: Conference Paper

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