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Journal of Electronic Materials

Volumn 39, Issue 2, 2010, Pages 230-237

Interfacial reaction of Sn and Cu-xZn substrates after reflow and thermal aging

(3) Yu, Chi Yang a Wang, Kai Jheng a Duh, Jenq Gong a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Cu Zn; Soldering; Under bump metallurgy (UBM)

Indexed keywords

ALTERNATIVE DESIGNS; COMPOSITION VARIATION; CU UNDER BUMP METALLURGIES; GROWTH MECHANISMS; INTERFACIAL MORPHOLOGIES; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; JOINT ASSEMBLY; KIRKENDALL VOID; MICROSCOPIC CHARACTERIZATION; MULTI-LAYERED; PURE SN; SOLDER JOINTS; TERNARY PHASE DIAGRAMS; UNDER-BUMP METALLURGIES; ZN CONTENT;

COPPER COMPOUNDS; METALLURGY; PHASE DIAGRAMS; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SOLDERING; SOLDERING ALLOYS; THERMAL AGING; ZINC;

TIN;

EID: 77951257605 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0992-z Document Type: Article

Times cited : (52)

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