Effects of alloying elements on the characteristics of Sn-Zn lead-free solder

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages 211-217

  Chen, Xi ^a   Li, Ming ^a   Ren, Xiaoxue ^a   Mao, Dali ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Alloying elements; Characteristics; Lead free solder; Oxidation resistance; Tin zinc

Indexed keywords

ALLOYING ELEMENTS; LEAD; OXIDATION RESISTANCE; TENSILE STRENGTH; TIN; WETTING; ZINC;

LEAD FREE SOLDER;

SOLDERING ALLOYS;

EID: 33846309615     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564675     Document Type: Conference Paper

References (12)

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