Effect of Ni-P thickness on solid-state interfacial reactions between Sn-3.5Ag solder and electroless Ni-P metallization on Cu substrate

Thin Solid Films

Volumn 504, Issue 1-2, 2006, Pages 410-415

  Kumar, Aditya ^a   Chen, Zhong ^a   Mhaisalkar, S G ^a   Wong, C C ^a   Teo, Poi Siong ^b   Kripesh, Vaidhyanathan ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Electroless nickel; Interfacial reaction; Intermetallic compound; Solder

Indexed keywords

COPPER; CRYSTALLIZATION; INTERMETALLICS; NICKEL ALLOYS; SURFACE CHEMISTRY; TIN ALLOYS;

ELECTROLESS NICKEL; INTERFACIAL REACTION; NI-P METALLIZATION;

SOLID STATE DEVICES;

EID: 33644922029     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.059     Document Type: Conference Paper

References (13)

1. C.Y. Liu, C. Chen, A.K. Mal, and K.N. Tu J. Appl. Phys. 85 1999 3882
2. M.O. Alam, Y.C. Chan, and K.N. Tu J. Appl. Phys. 94 2003 4108
3. Z. Chen, M. He, A. Kumar, G.J. Qi, J. Electron. Mater., in press.
4. K.N. Tu, and K. Zeng Mater. Sci. Eng., R Rep. 34 2001 1
5. C.Y. Lee, and K.L. Lin Thin Solid Films 249 1994 201
6. J.W. Jang, P.G. Kim, K.N. Tu, D.R. Frear, and P. Thompson J. Appl. Phys. 85 1999 8456
7. P.L. Liu, Z. Xu, and J.K. Shang Metall. Mater. Trans., A Phys. Metall. Mater. Sci. 31A 2000 2857
8. H. Matsuki, H. Ibuka, and H. Saka Sci. Technol. Adv. Mater. 3 2002 261
9. Y.D. Jeon, A. Ostmann, H. Reichl, and K.W. Paik Electron. Compon. Technol. Conf. (IEEE) 2003 1203
10. S.J. Wang, and C.Y. Liu Scr. Mater. 49 2003 813
11. M. He, Z. Chen, and G. Qi Acta Mater. 52 2004 2047
12. A. Kumar, M. He, and Z. Chen Surf. Coat. Technol. 198 2005 283
13. G.O. Mallory, and J.B. Hajdu Electroless Plating: Fundamental and Applications 1990 American Electroplaters and Surface Finishes Society Orlando