Wetting behavior and interfacial reactions in (Sn-9Zn)-2Cu/Ni joints during soldering and isothermal aging

Journal of Materials Science and Technology

Volumn 25, Issue 3, 2009, Pages 410-414

  Zhao, Ning ^a   Ma, Haitao ^a   Xie, Haiping ^a   Wang, Lai ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Aging; Interfacial reaction; Intermetallic compounds; Lead free solder

Indexed keywords

AGING; AGING TIME; IMC LAYER; INTERFACIAL MICROSTRUCTURE; INTERFACIAL REACTION; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; ISOTHERMAL AGING; LEAD-FREE SOLDER; LINEAR RELATIONSHIPS; MATRIX; NI ATOMS; NI SUBSTRATES; SN-9ZN SOLDER; SOLDER ALLOYS; SOLDER MATRIX; SQUARE ROOTS; WETTING ABILITY; WETTING BEHAVIOR; WETTING PROPERTY;

BRAZING; LEAD; LEAD COMPOUNDS; NICKEL; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SOLDERED JOINTS; SOLDERING ALLOYS; SUBSTRATES; WELDING; WETTING; ZINC;

TIN;

EID: 67549121769     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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