SCOPUS 정보 검색 플랫폼

Volumn 41, Issue 7, 2012, Pages 1907-1914

Disabling of nanoparticle effects at increased temperature in nanocomposite solders

(9) Mokhtari, Omid a Roshanghias, Ali b Ashayer, Roya a Kotadia, Hiren R a Khomamizadeh, Farzad b Kokabi, Amir H b Clode, Michael P a Miodownik, Mark a Mannan, Samjid H a

a KING'S COLLEGE LONDON (United Kingdom)

b SHARIF UNIVERSITY OF TECHNOLOGY (Iran)

Author keywords

grain boundary; hot compression; Nanocomposite; solder

Indexed keywords

DYNAMIC GRAIN GROWTH; EFFECTIVE VOLUME; GRAIN SIZE; HOMOLOGOUS TEMPERATURE; INCREASED TEMPERATURE; LOW HOMOLOGOUS TEMPERATURES; NANOCOMPOSITE SOLDER; NANOPARTICLE EFFECTS; REFLOW--SOLDERING; SILICA NANOPARTICLES; SOLDER ALLOYS; SOLDER PROPERTIES; ZENER-PINNING;

COMPRESSION TESTING; FLIP CHIP DEVICES; GOLD COATINGS; GRAIN BOUNDARIES; GRAIN GROWTH; HOT PRESSING; MECHANICAL PROPERTIES; NANOCOMPOSITES; NANOPARTICLES; SOLDERING;

SOLDERING ALLOYS;

EID: 84862239577 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-012-1976-y Document Type: Article

Times cited : (21)

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