SCOPUS 정보 검색 플랫폼

Materials Transactions

Volumn 52, Issue 2, 2011, Pages 189-195

Formation mechanism of eutectic Cu6Sn5and Ag 3Sn after growth of primary β-Sn in Sn-Ag-Cu alloy

(3) Takamatsu, Yoshiko a Esaka, Hisao a Shinozuka, Kei a

a NATIONAL DEFENSE ACADEMY (Japan)

Author keywords

Lead free solder; Nucleation; Solidification structure; Tin silver copper alloy; Undercooling

Indexed keywords

BINARY EUTECTICS; CU ALLOY; FORMATION MECHANISM; LEAD FREE SOLDERS; LIQUID COMPOSITIONS; NUCLEATION AND GROWTH; SN-AG-CU ALLOY; SNAGCU SOLDER; SOLIDIFICATION PROCESS; SOLIDIFICATION STRUCTURE; TERNARY EUTECTICS; THERMAL ANALYSIS; TIN-SILVER-COPPER ALLOYS;

ALLOYS; CERIUM ALLOYS; COPPER ALLOYS; EUTECTICS; LIQUIDS; MICROSTRUCTURE; NUCLEATION; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; THERMOANALYSIS; TIN ALLOYS; UNDERCOOLING;

TIN;

EID: 79953843433 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.M2010325 Document Type: Article

Times cited : (22)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.