Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

Journal of Applied Physics

Volumn 111, Issue 7, 2012, Pages

  Kotadia, H R ^a   Panneerselvam, A ^a   Mokhtari, O ^a   Green, M A ^a   Mannan, S H ^a  

^a KING'S COLLEGE LONDON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; INTERFACE STATES; INTERFACES (MATERIALS); INTERMETALLICS; SOLDERING ALLOYS; SPALLING; TIN; ZINC;

A-STABLE; AL CONTENT; AL-CONCENTRATION; CU SUBSTRATE; IMC LAYER; LIQUID-STATE REACTION; SOLDER ALLOYS; SOLDER VOLUME;

ALUMINUM;

EID: 84861740589     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3699359     Document Type: Conference Paper

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