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Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 12, 2007, Pages 1235-1238

Microstructure and mechanical properties of lead-free Sn-Cu solder composites prepared by rapid directional solidification

(4) Shen, Jun a Liu, Yongchang a Han, Yajing a Gao, Houxiu a

a TIANJIN UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

KINETIC UNDERCOOLING;

COMPRESSIVE STRENGTH; COPPER ALLOYS; INTERMETALLICS; LAMELLAR STRUCTURES; MECHANICAL PROPERTIES; MICROSTRUCTURE; RAPID SOLIDIFICATION; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 34548697983 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-007-9131-x Document Type: Article

Times cited : (15)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.