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Volumn 38 A, Issue 7, 2007, Pages 1530-1538

Solidification condition effects on microstructures and creep resistance of Sn-3.8Ag-0.7Cu lead-free solder

Author keywords

[No Author keywords available]

Indexed keywords

CREEP RESISTANCE; DEFORMATION; EUTECTICS; FRACTURE; METALLOGRAPHIC MICROSTRUCTURE; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SOLIDIFICATION; STRESSES;

EID: 34547404194     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-007-9222-6     Document Type: Conference Paper
Times cited : (17)

References (20)
  • 16
    • 0004294620 scopus 로고
    • McGraw-Hill Book Co., New York, NY
    • M.C. Flemings: Solidification Processing, McGraw-Hill Book Co., New York, NY, 1974, pp. 263-89
    • (1974) Solidification Processing , pp. 263-289
    • Flemings, M.C.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.