Effect of 0.5 wt% Cu in Sn-3.5%Ag solder to retard interfacial reactions with the electroless Ni-P metallization for BGA solder joints application

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 2 SPEC. ISS., 2008, Pages 431-438

  Alam, Mohammad Ohidul ^a,b   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

Ball grid array (BGA); Electroless Ni; Interfacial reaction; intermetallic compound (IMC); Reflow; Solder joint

Indexed keywords

BALL GRID ARRAY (BGA); ELECTROLESS NI; INTERFACIAL REACTION; INTERMETALLIC COMPOUND (IMC); REFLOW; SOLDER JOINT;

BALL GRID ARRAYS; BRAZING; COPPER ALLOYS; CRYSTALLINE MATERIALS; DISSOLUTION; ELECTRIC CURRENTS; FLIP CHIP DEVICES; METALLIZING; MICROELECTRONICS; NICKEL; REACTION RATES; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS; WELDING;

TIN;

EID: 61849109653     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.921641     Document Type: Conference Paper

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