SCOPUS 정보 검색 플랫폼

Journal of Materials Science: Materials in Electronics

Volumn 20, Issue 12, 2009, Pages 1239-1246

Effects of Ga-Ag, Ga-Al and Al-Ag additions on the wetting characteristics of Sn-9Zn-X-Y lead-free solders

(4) Wang, Hui a Xue, Songbai a Chen, Wenxue a Zhao, Feng b

a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS (China)

b LOUGHBOROUGH UNIVERSITY (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AG ADDITIONS; ALUMINUM OXIDE FILMS; BINARY ADDITIONS; BULK LIQUID; LEAD FREE SOLDERS; REACTION ENERGY; WETTING BALANCE METHODS; WETTING CHARACTERISTICS;

ALUMINA; ALUMINUM; GALLIUM; GALLIUM ALLOYS; LEAD; OXIDE FILMS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; WETTING; ZINC;

TIN;

EID: 70350345407 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-009-9859-6 Document Type: Article

Times cited : (14)

References (12)

1
- 58249088860
- doi: 10.1007/s10854-008-9666-5
- P. Jiang, Y.C. Liu, C. Wei et al., J. Mater. Sci.: Mater. Electron. 20, 139 (2009). doi: 10.1007/s10854-008-9666-5
- (2009) J. Mater. Sci.: Mater. Electron. , vol.20 , pp. 139
- Jiang, P.¹ Liu, Y.C.² Wei, C.³

2
- 58249089739
- doi: 10.1007/s10854-008-9696-z
- G.D. Li, Y.W. Shi, H. Hao, et al., J. Mater. Sci.: Mater. Electron. 20, 186 (2009). doi: 10.1007/s10854-008-9696-z
- (2009) J. Mater. Sci.: Mater. Electron. , vol.20 , pp. 186
- Li, G.D.¹ Shi, Y.W.² Hao, H.³

3
- 33845688716
- doi: 10.1007/s10854-006-9018-2
- K. Suganuma, K.S. Kim, J. Mater. Sci.: Mater. Electron. 18, 121 (2007). doi: 10.1007/s10854-006-9018-2
- (2007) J. Mater. Sci.: Mater. Electron. , vol.18 , pp. 121
- Suganuma, K.¹ Kim, K.S.²

4
- 27644553870
- doi: 10.1016/j.scriptamat.2005.09.033
- N.S. Liu, K.L. Lin, Scr. Mater. 54, 219 (2006). doi: 10.1016/ j.scriptamat.2005.09.033
- (2006) Scr. Mater. , vol.54 , pp. 219
- Liu, N.S.¹ Lin, K.L.²

5
- 0037326635
- doi: 10.1007/s11664-003-0242-8
- K.L. Lin, C.L. Shih, J. Electron. Mater. 32, 95 (2003). doi: 10.1007/ s11664-003-0242-8
- (2003) J. Electron. Mater. , vol.32 , pp. 95
- Lin, K.L.¹ Shih, C.L.²

6
- 0032206905
- doi: 10.1007/s11664-998-0070-y
- K.L. Lin, Y.C. Wang, J. Electron. Mater. 27, 1205 (1998). doi: 10.1007/ s11664-998-0070-y
- (1998) J. Electron. Mater. , vol.27 , pp. 1205
- Lin, K.L.¹ Wang, Y.C.²

7
- 0032187661
- doi: 10.1023/A:1018840405283
- K.L. Lin, T.P. Liu, Oxid. Metab. 50, 255 (1998). doi: 10.1023/ A:1018840405283
- (1998) Oxid. Metab. , vol.50 , pp. 255
- Lin, K.L.¹ Liu, T.P.²

8
- 0033747819
- Lead-free solders in microelectronics
- doi: 10.1016/S0927-796X(00)00010-3
- M. Abtewa, G. Selvaduray, Lead-free solders in microelectronics. Mater. Sci. Eng. R. Rep. 27, 95 (2000). doi: 10.1016/S0927-796X(00)00010-3
- (2000) Mater. Sci. Eng. R. Rep. , vol.27 , pp. 95
- Abtewa, M.¹ Selvaduray, G.²

9
- 1842612369
- doi: 10.1016/j.jnoncrysol.2004.01.013
- Y. Zhang, T.X. Liang, M.A. Jusheng, J. Non-Cryst. Solids 336, 153 (2004). doi: 10.1016/j.jnoncrysol.2004.01.013
- (2004) J. Non-Cryst. Solids , vol.336 , pp. 153
- Zhang, Y.¹ Liang, T.X.² Jusheng, M.A.³

10
- 0021478058
- Q.Y. Zhang, S.Q. Liu, D.S. Liu, Acta Metall. Sin. 20, A296 (1984)
- (1984) Acta Metall. Sin. , vol.20
- Zhang, Q.Y.¹ Liu, S.Q.² Liu, D.S.³

11
- 29544446219
- doi: 10.1016/j.msea.2005.08.185
- Y.L. Tsai, W.S. Hwang, Mater. Sci. Eng. A 413-414, 312 (2005). doi: 10.1016/j.msea.2005.08.185
- (2005) Mater. Sci. Eng. A , vol.413-414 , pp. 312
- Tsai, Y.L.¹ Hwang, W.S.²

12
- 33748086465
- doi: 10.1016/j.jallcom.2005.09.094
- T.C. Chang, J.W. Wang, M.C. Wang, M.H. Hon, J. Alloy. Comp. 422, 239 (2006). doi: 10.1016/j.jallcom.2005.09.094
- (2006) J. Alloy. Comp. , vol.422 , pp. 239
- Chang, T.C.¹ Wang, J.W.² Wang, M.C.³ Hon, M.H.⁴

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.