Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates

Journal of Alloys and Compounds

Volumn 511, Issue 1, 2012, Pages 176-188

  Kotadia, H R ^a   Mokhtari, O ^a   Clode, M P ^a   Green, M A ^a   Mannan, S H ^a  

^a KING'S COLLEGE LONDON   (United Kingdom)

Author keywords

Intermetallic compounds; Lead free solder; Sn Ag Cu alloys; Soldering

Indexed keywords

COPPER ALLOYS; COPPER COMPOUNDS; INTERFACES (MATERIALS); INTERMETALLICS; LEAD-FREE SOLDERS; NICKEL; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS; ZINC;

BARRIER LAYERS; COMPOSITION CHANGES; HIGH TEMPERATURE; INTERFACIAL INTERMETALLICS; INTERMETALLIC COMPOUND GROWTHS; SN-AG-CU ALLOY; SUBSTRATE SYSTEM; WETTING ANGLE;

TIN;

EID: 80054704788     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2011.09.024     Document Type: Article

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