Electronics assembly and high temperature reliability using sn-3.8ag-0.7cu solder paste with zn additives

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 3, Issue 10, 2013, Pages 1786-1793

  Kotadia, Hiren R ^a   Panneerselvam, Arunkumar ^a   Sugden, Mark W ^b   Steen, Hector ^c   Green, Mark ^a   Mannan, Samjid H ^a  

^a KING'S COLLEGE LONDON   (United Kingdom)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^c Henkel Technologies   (United Kingdom)

Author keywords

Intermetallic growth suppression; Lead free solder; Sn ag cu alloys; Soldering; Zn

Indexed keywords

COPPER; COPPER ALLOYS; COPPER COMPOUNDS; INTERMETALLICS; LEAD-FREE SOLDERS; NICKEL; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; SUBSTRATES; TIN; ZINC;

ELECTRONICS ASSEMBLY; HIGH TEMPERATURE AGING; INTERMETALLIC GROWTH; MICROMETER SIZED PARTICLES; ORGANIC SOLDERABILITY PRESERVATIVE; POLYIMIDE SUBSTRATE; SN-3.8AG-0.7CU SOLDER; SN-AG-CU ALLOY;

SOLDERING ALLOYS;

EID: 84885600942     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2013.2279055     Document Type: Article

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